EP3SE50F484C3 vs EP3SE50F484C3N 比較
詳細並排比較 EP3SE50F484C3 由 Altera 與 EP3SE50F484C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE50F484C3 | EP3SE50F484C3N |
|---|---|---|
| 品牌 | Altera | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | Obsolete |
| Device Family | Stratix III E (Enhanced) | — |
| Logic Elements (LE) | 47,500 | — |
| Adaptive Logic Modules (ALM) | 19,000 | — |
| Embedded Memory (M9K + M144K) | 5,760 Kbits | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| User I/Os | 296 | 296 |
| User I/O Banks | [DATA_NEEDED: number of user I/O banks] | — |
| High-Speed Transceivers | [DATA_NEEDED: package-dependent count for 484-FBGA] | — |
| Internal Operating Frequency | Up to 800 MHz | — |
| Process Technology | 40 nm TSMC | TSMC 40 nm low-power CMOS |
| Speed Grade | C3 (mid) | — |
| 工作溫度 | 0C to 85C (Commercial) | 0C to +85 C (commercial, C suffix) |
| Supply Voltage (Core) | [DATA_NEEDED: nominal core voltage] | — |
| 封裝 | 484-ball FBGA (FineLine BGA) | 484-ball FBGA (FCBGA), 1.0 mm pitch |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Lead-Free / RoHS | [DATA_NEEDED: lead-free / RoHS status from manufacturer] | — |
| MSL 等級 | [DATA_NEEDED: moisture sensitivity level] | 3 (per JEDEC J-STD-020 for FCBGA packages) |
| Family | — | Stratix III E |
| Device Logic Elements | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Adaptive Logic Modules (ALMs) | — | 18,750 |
| Embedded Memory (Bits) | — | 5,760,000 |
| Maximum Internal Frequency | — | 717 MHz (typical); 800 MHz per DigChip |
| 供應電壓 | — | Core and I/O voltages per Stratix III E datasheet |
| RoHS 狀態 | — | Lead-free (per DigiKey listing) |
| Configuration Mode | — | Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG |
| Design Software | — | Intel Quartus II (Stratix III support) |
| 生命週期狀態 | — | Obsolete (per Worldway listing 2026-04-05) |