EP3SE50F484I4L vs EP3SE50F484I3N 比較

詳細並排比較 EP3SE50F484I4L 由 Intel 與 EP3SE50F484I3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE50F484I4L EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

EP3SE50F484I4L - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel

EP3SE50F484I4L ⚠ 最後購買機會

規格比較

參數 EP3SE50F484I4L EP3SE50F484I3N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 NRND
Family Stratix III E Stratix III E
Logic Elements (LE) 47,500 —
Logic Array Blocks (LABs) 1,900 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory 5,760 Kbit (5.625 Mbit) —
Embedded Multipliers (18x18) 384 [DATA_NEEDED: number of 18x18 multipliers]
Maximum User I/O 296 296
Maximum Core Clock 717 MHz (per third-party listing) —
Speed Grade 4 (slowest) I3 (industrial, bin 3)
工作溫度範圍 Industrial (I): -40C to +100C junction —
Process Node 40 nm CMOS —
封裝 484-ball FCBGA (FBGA-484) 484-pin FC-FBGA (flip-chip BGA)
安裝類型 Surface Mount (BGA) Surface Mount (BGA)
供應電壓 Multiple rails: core 0.9V, I/O 1.2V-3.3V (per Stratix III handbook) —
Configuration Method Quartus II / EPCS serial / parallel Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP)
Lead-Free (Pb-free) Yes (L suffix) —
RoHS 狀態 Compliant —
MSL 等級 MSL3 (per JEDEC J-STD-020, typical for FBGA-484) —
Logic Elements — 47,500
Number of LABs — 1,900
Total Memory Bits — 5,760,000
Number of I/O Banks — [DATA_NEEDED: number of I/O banks]
Core Voltage VCC — 0.9 V
Auxiliary Voltage VCCAUX — 1.1 V
Process Technology — 65 nm
Maximum Internal Frequency — 500 MHz
工作溫度 — -40C to +100C (industrial)
Lead-Free / RoHS — Yes (N suffix)
DSP Blocks — [DATA_NEEDED: number of DSP blocks]
Transceiver Count — [DATA_NEEDED: number of embedded transceivers]

資料表與資源

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