EP3SE50F780C4N vs EP3SE50F780C3N 比較

詳細並排比較 EP3SE50F780C4N 由 Intel 與 EP3SE50F780C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE50F780C4N EP3SE50F780C3N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family Stratix III E Stratix III E
Logic Elements (LE) 47,500 —
Embedded Memory Bits 5,760,000 —
Embedded Memory (M9K/M144K blocks) 488 (per family datasheet) —
Number of LABs 1900 —
Maximum User I/Os 488 488
DSP Blocks (18x18 multipliers) 432 —
PLLs 12 (per family datasheet) —
Maximum Operating Frequency 717 MHz —
Transceiver Channels Up to 12 (per family, model-dependent) —
Transceiver Data Rate Up to 6.375 Gbps (per Stratix III E family) —
Process Node 40 nm —
封裝 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch 780-ball FC-FBGA
安裝類型 Surface Mount (BGA) Surface Mount
供應電壓 Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) —
工作溫度 0C to +85C (C4 commercial grade) —
Configuration Modes JTAG, Passive Serial, Fast Passive Parallel —
RoHS 狀態 Lead-free / RoHS compliant Compliant
MSL 等級 3 (per JEDEC J-STD-020, FBGA package) —
Hard Memory Controller DDR2/DDR3 SDRAM (per Stratix III E family) —
Logic Elements — 47,500
Logic Array Blocks (LABs) — 1,900
Embedded Memory (M9K blocks) — 312
Total Embedded Memory — 5,760 Kbit (5.76 Mbit)
DSP Blocks — 432
Number of PLLs — 4
Process Technology — 65 nm
Core Voltage — 1.1 V
Speed Grade — C3 (medium)
Temperature Grade — Commercial (0C to +85C)
Lead-Free — Yes

資料表與資源

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