EP3SL70F780I3N vs EP3SL70F780I3G 比較
詳細並排比較 EP3SL70F780I3N 由 Intel 與 EP3SL70F780I3G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SL70F780I3N | EP3SL70F780I3G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | NRND |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | — |
| Logic Array Blocks (LABs) | 2,700 | — |
| Embedded Memory (bits) | 2,699,264 | — |
| User I/Os | 488 | 488 |
| Process Technology | 65 nm CMOS | 40 nm TSMC |
| Core Voltage | 1.1 V (1.05 V to 1.15 V) | — |
| Operating Frequency | 500 MHz | — |
| Speed Grade | I3 (industrial) | 3 (Medium) |
| Package Type | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) | — |
| Ball Pitch | 1.0 mm | — |
| 工作接面溫度 | -40 C to +100 C | — |
| Configuration | SRAM-based, volatile | External (EPCS / JTAG) |
| 安裝類型 | Surface Mount | Surface Mount |
| RoHS 狀態 | Compliant (per distributor listings) | Compliant |
| Logic Elements (LE) | — | 67,500 |
| Adaptive Logic Modules (ALM) | — | 27,000 ALM |
| Embedded Memory | — | 2,699,264 bits (2.57 Mbit) |
| 封裝 | — | 780-BBGA, FCBGA (29x29 mm) |
| Core Voltage (VCCINT) | — | 1.1 V |
| 工作溫度 | — | -40C to +100C (Industrial) |
| 記憶體類型 | — | SRAM-based, external configuration |
| DSP Blocks | — | Multipliers, count varies by die |
| Packaging | — | Tray |