EP4SGX360FF35C4 vs EP4SGX360FF35C2X 比較

詳細並排比較 EP4SGX360FF35C4 由 Intel 與 EP4SGX360FF35C2X 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP4SGX360FF35C4 EP4SGX360FF35C2X
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete 啟用中
Family Stratix IV GX Stratix IV GX
Logic Elements 353600 353,600
Number of LABs/CLBs 14144 —
Total RAM Bits 23105536 —
Number of I/O 564 —
Number of Transceivers 8 24
Core Voltage 0.9 V —
Process Technology 40 nm —
封裝 1152-BBGA, FCBGA (flip-chip) 1152-ball FCBGA (FF35), 35 x 35 mm, 1.0 mm pitch
工作溫度 0C to +85C (commercial) —
安裝類型 Surface Mount Surface Mount
MSL 等級 3 (per JEDEC J-STD-020) [DATA_NEEDED: MSL rating]
RoHS 狀態 [DATA_NEEDED: rohs status] Compliant
Lead-Free Yes (per BGA finish) Yes
Supplier Device Package 1152-FBGA —
Adaptive Logic Modules (LABs) — 14,144
Embedded Memory — 23,105,536 bits
User I/O Pins — 564
Max Transceiver Data Rate — 8.5 Gbps
DSP Blocks (18x18 multipliers) — 1,288
Global Clock Networks — 32
Process Node — 40 nm CMOS
Speed Grade — C2 (fastest)
工作接面溫度 — 0 °C to +85 °C (commercial)
Design Software — Quartus II

資料表與資源

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