EP4SGX70DF29C2XN vs EP4SGX70DF29C4G 比較

詳細並排比較 EP4SGX70DF29C2XN 由 Intel 與 EP4SGX70DF29C4G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP4SGX70DF29C2XN EP4SGX70DF29C2XN - Stratix IV GX FPGA 72.6K LE 780-FCBGA | Intel

EP4SGX70DF29C2XN - Stratix IV GX FPGA 72.6K LE 780-FCBGA | Intel

EP4SGX70DF29C2XN ⚠ 最後購買機會

規格比較

參數 EP4SGX70DF29C2XN EP4SGX70DF29C4G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 啟用中
Family Stratix IV GX Stratix IV
Logic Elements 72,600 —
Logic Array Blocks (LABs) 2,904 —
Embedded Memory 7,564,880 bits —
User I/Os 372 —
Transceivers Up to 24 channels at 8.5 Gbps —
Core Voltage 0.9 V —
Process Technology 40 nm —
封裝 780-ball FC-FBGA (DF29) —
Operating Temperature Grade Industrial (as indicated by 'I' suffix in MPN) —
Speed Grade C2 (lower-power commercial/industrial variant) C4 (commercial)
Hard IP Blocks PCIe Gen2, embedded transceiver PCS —
安裝類型 Surface Mount (FCBGA) Surface Mount
MSL 等級 [DATA_NEEDED: MSL rating] —
RoHS 狀態 [DATA_NEEDED: RoHS compliance status] Compliant
Series — Stratix IV GX
Logic Elements (LE) — 72,600
Total Memory Bits — 7,564,880
User I/O Count — 372
Number of Transceivers — 8
Transceiver Data Rate (max) — 8.5 Gbps
Package Type — 780-BBGA, FCBGA
Package Code — BGA
Package Body Size — 29 mm × 29 mm
Ball Pitch — 1.0 mm
Process Node — 40 nm
工作溫度 — [DATA_NEEDED: Operating Temperature Range]

資料表與資源

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