EPM1270F256I5N vs EPM2210F256C4N 比較
詳細並排比較 EPM1270F256I5N 由 Intel 與 EPM2210F256C4N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EPM1270F256I5N | EPM2210F256C4N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Series | MAX II | — |
| Family | MAX II (EPM1270) | MAX II |
| Device Type | CPLD - Complex Programmable Logic Device | CPLD |
| Macro Cells | 980 | 1700 |
| Logic Elements | 1270 | — |
| User I/O Pins | 212 | — |
| User Flash Memory | 8 Kbits | 204 Kbit |
| Maximum Operating Frequency | 201.1 MHz | — |
| Pin-to-Pin Logic Delay | 6.2 ns (I5 speed grade) | — |
| External Supply Voltage | 2.5 V / 3.3 V | — |
| Internal Core Voltage | 1.8 V (on-chip regulator) | — |
| I/O Bank Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) + 3.3 V PCI-compliant bank | — |
| Process Technology | 0.18-micron Flash-based CMOS | 0.18 µm |
| Configuration Memory | Non-volatile Flash (instant-on) | — |
| Programming Interface | JTAG IEEE 1149.1 (boundary-scan + ISP) | JTAG IEEE Std. 1149.1 + ISP |
| 封裝 | 256-ball FBGA (FineLine BGA), 17 x 17 mm | 256-ball FineLine BGA (FBGA) |
| 工作溫度 | -40C to +100C (TJ), industrial | — |
| Speed Grade | I5 (industrial, 6.2 ns tPD) | — |
| 安裝類型 | Surface Mount (SMT, BGA) | Surface Mount (BGA) |
| RoHS 狀態 | Compliant | Compliant |
| 無鹵素 | Compliant (per GlobalSpec) | — |
| Country of Origin | Malaysia / Republic of Korea | — |
| Logic Elements (LE) | — | 2210 |
| Maximum Internal Frequency | — | 247.5 MHz |
| Pin-to-Pin Propagation Delay (tPD) | — | 7.0 ns |
| Maximum User I/O Pins | — | 212 (varies with package) |
| Global Clock Networks | — | 4 |
| Core Supply Voltage | — | 3.0 V to 3.6 V (3.3 V typical) |
| MultiVolt I/O Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVTTL/LVCMOS, PCI 66 MHz |
| 工作溫度範圍 | — | 0 °C to +85 °C (Commercial) |
| Lead-Free | — | Yes |