EPM2210GF324C5 vs EPM2210GF324I5N 比較
詳細並排比較 EPM2210GF324C5 由 Intel 與 EPM2210GF324I5N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EPM2210GF324C5 | EPM2210GF324I5N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | 啟用中 |
| Family | MAX II | — |
| Device Name | EPM2210 | — |
| Logic Elements (LE) | 2,210 | — |
| Equivalent Macrocells | 1,700 | 1700 |
| Maximum User I/Os | 272 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Pin-to-Pin Delay (tPD1) | 5 ns (C5 speed grade) | — |
| Internal Performance | 304 MHz | — |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V (typical) |
| I/O Voltage (VCCIO) - MultiVolt | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 6-layer-metal flash, 0.18 um | 0.18 µm 6-layer-metal flash |
| 工作接面溫度 | 0C to +85C (commercial) | — |
| 封裝 | 324-ball FineLine BGA (GF324), 1.0 mm pitch, 19 x 19 mm | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch |
| In-System Programmability | JTAG (IEEE 1149.1) | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| RoHS 狀態 | Compliant (lead-free) | — |
| Device Family | — | MAX II |
| Logic Elements | — | 2210 |
| User I/O | — | 272 |
| Propagation Delay (tPD) | — | 7 ns |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| 工作溫度 | — | -40 °C to +100 °C (TJ) |
| Programmability | — | In-System Programmable (JTAG / ISP) |
| Lead Free / RoHS | — | Yes (RoHS compliant) |
| MSL 等級 | — | [DATA_NEEDED: MSL rating] |