EPM570M256C4N vs EPM570GM256C5N 比較

詳細並排比較 EPM570M256C4N 由 Intel 與 EPM570GM256C5N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EPM570M256C4N EPM570GM256C5N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family MAX II CPLD - Complex Programmable Logic Device
Device Logic Elements 440 LE —
Macro Cells 440 440
Maximum User I/Os 160 —
User Flash Memory (UFM) 8 Kbit —
Internal Performance (fMAX) 247.5 MHz —
Core Supply Voltage (VCCINT) 1.8 V —
I/O Supply Voltage (VCCIO) 2.5 V / 3.3 V —
Process Technology 0.18 µm CMOS 0.18 um flash-based CMOS
Configuration Memory On-chip Flash (non-volatile, instant-on ≤ 0.5 ms) Internal flash (non-volatile, instant-on)
Programming Interface JTAG (IEEE 1149.1) / ISP —
封裝 256-ball Micro FineLine BGA (MBGA), 11 × 11 mm —
安裝類型 Surface Mount (BGA) —
工作溫度 -40 °C to +125 °C 0 °C to +85 °C (commercial)
Lead-Free / RoHS Yes, LEAD FREE (per datasheet.com spec listing) —
Logic Family CMOS —
Series — MAX II
Logic Array Blocks (LABs) — 57
Number of I/Os — 160
Maximum Operating Frequency — 304 MHz
Maximum Internal Frequency (datasheet fMAX) — 201.1 MHz
Pin-to-Pin Logic Delay (Speed Grade C5) — 5 ns
Operating Supply Voltage (Core VCCINT) — 1.71 V to 1.89 V (1.8 V nominal)
I/O Bank Supply Voltages — 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt I/O)
Programmable Type — In System Programmable (ISP) via JTAG
封裝 / 外殼 — 256-ball Micro FineLine BGA, 11x11 mm, 0.8 mm pitch
安裝方式 — SMD/SMT
Packaging — Tray
Lead Free / RoHS Status — See manufacturer page; legacy part - verify per lot
JTAG Support — Yes (IEEE 1149.1 / 1532)
Vertical Migration — Pin-compatible with EPM1270 and EPM2210 in the 256-MBGA package

資料表與資源

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