GX36220 vs GX36420-DNT 比較
詳細並排比較 GX36220 由 Renesas Electronics 與 GX36420-DNT 由 Renesas Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Renesas Electronics
GX36220 - 2x64Gb/s Dual Linear TIA for 400G Coherent ROSA | Renesas
GX36220 ✓ 啟用中規格比較
| 參數 | GX36220 | GX36420-DNT |
|---|---|---|
| 品牌 | Renesas Electronics | Renesas Electronics |
| 類別 | Amplifier ICs | Amplifier ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Product Type | Dual linear Trans-Impedance Amplifier (TIA) | — |
| Number of Channels | 2 (I and Q) | 4 (XI, XQ, YI, YQ) |
| Per-Channel Data Rate | 32 Gb/s (32 GBaud) | — |
| Aggregate Data Rate | 2x64 Gb/s | — |
| Target Application | 400G coherent Receiver Optical Sub-Assembly (ROSA) | — |
| Modulation Support | DP-16QAM and higher-order coherent formats | — |
| Bandwidth | Approximately 28 GHz per channel [DATA_NEEDED: exact -3dB bandwidth] | — |
| Input-Referred Noise | Sub-pA/sqrt(Hz) class [DATA_NEEDED: exact value] | [DATA_NEEDED: Input-Referred Noise] |
| Differential Trans-Impedance | Multi-kΩ class [DATA_NEEDED: exact ZT] | — |
| 供應電壓 | [DATA_NEEDED: VCC range] | [DATA_NEEDED: Supply Voltage] |
| Power Dissipation | [DATA_NEEDED: per-channel and total] | — |
| Process Technology | SiGe BiCMOS [DATA_NEEDED: confirmed fT] | — |
| 封裝 | Bare die (DIE SALE - WAFER) | Bare die (no package) |
| 工作溫度 | [DATA_NEEDED: industrial/coherent-grade range] | [DATA_NEEDED: Operating Temperature Range] |
| RoHS 狀態 | [DATA_NEEDED: confirm from datasheet] | [DATA_NEEDED: RoHS Status] |
| Device Type | — | Linear Quad Transimpedance Amplifier (TIA) Die |
| Data Rate per Lane | — | 64 Gbps |
| Application Target | — | 400G/600G coherent optical receivers |
| Integrated DC Control Interface | — | Digital interface circuitry for DC controls |
| Supply Form | — | Bare die (DIE SALE - PRICE IN GOOD DIE - WAF) |
| Transimpedance Gain | — | [DATA_NEEDED: Transimpedance Gain] |
| Bandwidth per Lane | — | [DATA_NEEDED: Bandwidth per Lane] |
| Power Consumption | — | [DATA_NEEDED: Power Consumption] |
| Differential Output Swing | — | [DATA_NEEDED: Differential Output Swing] |
| MSL 等級 | — | Not applicable (bare die) |
| 安裝類型 | — | Die attach / wire bond (custom packaging) |