GX36420-DNT - 4x64Gb/s Linear Quad TIA Die | Renesas
MPN： GX36420-DNT ✓ 啟用中GX36420-DNT 概覽
A linear transimpedance amplifier is an analog front-end component that converts the weak photocurrent generated by a photodiode into a proportional output voltage. In coherent optical communication systems, linear TIAs (rather than limiting TIAs) preserve the amplitude and phase information of the received signal so that a downstream digital signal processor (DSP) can perform equalization, carrier recovery, and constellation demapping. The TIA sits at the front of the receiver signal chain: photodiode -> TIA -> linear post amplifier -> ADC -> DSP, making its noise, bandwidth, and linearity decisive for optical link sensitivity and reach.
The quad-lane integration of the GX36420 covering XI, XQ, YI, and YQ channels is its headline feature: one die handles all four arms of a dual-polarization coherent receiver, reducing die count, wire-bond complexity, and inter-channel mismatch in 400G/600G module designs. Its 64Gbps-per-lane data rate supports 400G (4x100G) and higher-baud coherent transceivers, and the integrated digital DC-control interface allows closed-loop adjustment of operating points over the module microcontroller bus.
Typical applications include 400G and 600G coherent optical transceivers for data-center interconnect and long-haul telecom, coherent receiver optical sub-assemblies (ROSA), and integration into PIC-based photonic modules where a good-die sourcing model is required.
Design consideration: because this is a bare-die product, electrical performance depends heavily on the customer's die-attach, wire-bond, and impedance-matching strategy; consult the Renesas die design kit and application support before layout. As a bare die, it is not AEC-Q100 packaged-device qualified and requires controlled assembly conditions.
This page synthesizes distributor pricing, lifecycle data, and drop-in-alternative information for the GX36420-DNT that is not consolidated on any single manufacturer or distributor page.
直接替換替代品，適用於 GX36420-DNT — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： GX36420-DNT （相同外形與佔位） — 差異在於 Number of Channels, Target Application, Device Type, MSL Level, Package.
GX36420-F-DNT
✅ 直接替換聯絡詢價
查看資料表 →GX36420-DNT 最大額定值與電氣特性
| Device Type | Linear Quad Transimpedance Amplifier (TIA) Die |
| Number of Channels | 4 (XI, XQ, YI, YQ) |
| Data Rate per Lane | 64 Gbps |
| Application Target | 400G/600G coherent optical receivers |
| Integrated DC Control Interface | Digital interface circuitry for DC controls |
| Supply Form | Bare die (DIE SALE - PRICE IN GOOD DIE - WAF) |
| 封裝 | Bare die (no package) |
| MSL 等級 | Not applicable (bare die) |
| 安裝類型 | Die attach / wire bond (custom packaging) |
GX36420-DNT bare die (no package) 腳位配置指南
GX36420-DNT（bare die (no package) 封裝）的腳位配置。 此類比元件具有輸入、輸出與電源腳位。偏移歸零、補償與致能腳位配置請參閱製造商資料表。適用於訊號調理與放大器電路。
無詳細腳位定義資料： GX36420-DNT.
請參閱 資料表 以查看完整腳位配置。
典型應用
GX36420-DNT 適用於 6 應用s: 400G Coherent Optical Transceivers, 600G Coherent Receivers, Coherent Receiver Optical Sub-Assemblies (ROSA), Photonic Integrated Circuit (PIC) Modules, Data Center Interconnect (DCI), Telecom Long-Haul Transmission Systems.
400G Coherent Optical Transceivers
The GX36420-DNT is purpose-built for 400G coherent optical transceiver receivers, where four linear TIA lanes at 64 Gbps each convert the photocurrents from the XI, XQ, YI, and YQ photodiodes of a dual-polarization coherent receiver. Because it is a linear TIA, it preserves amplitude and phase information so the module DSP can perform chromatic-dispersion equalization and carrier-phase recovery, directly setting receiver sensitivity and optical reach. Die-level integration of all four lanes minimizes bond-wire parasitics that would otherwise erode 64Gbaud bandwidth headroom, and the digital DC-control interface lets the module microcontroller trim each lane's operating point for gain and offset calibration over temperature.
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600G Coherent Receivers
For next-generation 600G coherent modules using higher-baud operation, the GX36420-DNT's 64 Gbps-per-lane linear TIA bandwidth provides the analog front-end needed before the ADC and DSP stages. In this role the four on-die TIAs handle the increased symbol rate of 600G dual-polarization schemes while the integrated DC-control circuitry supports continuous adaptive biasing as link conditions change. Supplying the amplifier as a good die allows module makers to co-package the TIA directly on the receiver optical sub-assembly (ROSA) alongside the photodiode array, shortening the critical photocurrent path and reducing inter-channel skew, which is a decisive factor in meeting 600G OSNR budgets.
推薦
Coherent Receiver Optical Sub-Assemblies (ROSA)
Within a coherent ROSA, the GX36420-DNT die is bonded directly to the dual-polarization 90-degree hybrid photodiode array, converting the four photocurrent outputs (XI, XQ, YI, YQ) with matched transimpedance across channels. Bare-die integration is the preferred architecture here because bond-wire inductance between photodiode and TIA is the dominant bandwidth limiter at 64 Gbps; co-packaging keeps this path sub-millimeter. Designers should follow the Renesas die design kit for pad coordinates and bond-wire guidelines, and use the digital DC-control bus to equalize gain and DC offsets across the four lanes so the DSP sees a balanced constellation at the ADC input.
推薦
Photonic Integrated Circuit (PIC) Modules
PIC-based coherent modules integrate lasers, modulators, and photodetectors on a photonic chip, and the GX36420-DNT die complements such PICs as the electronics-side quad linear TIA. Its die-sale supply model (DIE SALE - PRICE IN GOOD DIE - WAF) matches PIC co-packaging flows, where dies are singulated, attached, and wire-bonded in the customer's hybrid assembly line. The 64 Gbps linear lanes cover the four coherent arms in one die, cutting die count versus single-lane TIAs and improving channel matching because all four amplifiers share one silicon process and temperature environment - a measurable advantage for polarization-multiplexed QPSK/16QAM receivers.
推薦
Data Center Interconnect (DCI)
Data-center interconnect links at 400G and beyond rely on coherent optics for metro and long-haul spans, and the GX36420-DNT supplies the receiver analog front end for such coherent transceivers. Its 64 Gbps linear lanes enable the high-baud signaling these links require, while linear operation preserves the signal fidelity needed for DSP-based dispersion compensation over tens of kilometers. Die-level sourcing lets DCI module vendors integrate the TIA directly into compact OSFP/QSFP-DD form factors where board-level amplifier footprints would not fit, and the shared-die architecture keeps the four lanes' gain and phase tightly matched for stable dual-polarization demodulation.
推薦
Telecom Long-Haul Transmission Systems
In long-haul telecom receivers, the GX36420-DNT's quad 64Gbps linear TIA die converts weak photocurrents from coherent photodiodes into linearity-preserving voltage signals, which is what allows the DSP to recover QPSK or higher-order QAM constellations after thousands of kilometers of fiber. The integrated digital DC-control circuitry supports per-channel gain and offset trimming needed to compensate fiber aging and amplifier drift, and die-form integration keeps the photodiode-to-TIA interconnect short enough to sustain 64 Gbaud. For system vendors this translates into higher optical-signal-to-noise-ratio margins and longer unrepeatered spans per channel.
推薦
推薦產品摘要
工程參考資料，適用於 GX36420-DNT — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | GX36420-F-DNT |
|---|---|---|
| Package | Bare die (DIE SALE - WAF) | Bare die (same die design, alternate flow) |
| Brand | Renesas Electronics | Renesas Electronics |
| Channels | 4 (XI, XQ, YI, YQ) | 4 (XI, XQ, YI, YQ) |
| Data Rate per Lane | 64 Gbps | 64 Gbps |
| TIA Type | Linear | Linear |
| DC Control Interface | Digital interface, integrated | Digital interface, integrated |
| Target Application | 400G/600G coherent | 400G/600G coherent |
主要差異化特點
- Quad-lane integration on a single die (對比GX36420-F-DNT (and single-lane TIAs generally))
- Linear (not limiting) signal path (對比Limiting TIAs)
- Integrated digital DC-control interface (對比TIA dies with analog-only control)
設計說明
At 64 Gbps per lane, bond-wire inductance between the photodiode and each TIA input is the dominant bandwidth limiter. Keep photodiode-to-die bonds as short as possible (sub-millimeter where feasible), use symmetric bond geometries across all four lanes to preserve channel-to-channel matching, and follow the pad coordinates and electrical models in the Renesas die design kit rather than estimating. Simulate the complete photodiode-bond-TIA-load chain at 64Gbaud before committing to a bond diagram.
Although the GX36420-DNT is a die, its carrier substrate follows RF co-packaging practice: dedicate solid ground planes directly under the die attach area, place supply decoupling capacitors within a few millimeters of the die's supply pads, and route the four differential output pairs on controlled-impedance (100-ohm differential, per your DSP input spec) traces of equal length. The digital DC-control bus can be routed more leisurely, but keep it away from the 64Gbps lanes to avoid coupling control noise into the linear signal path.
Do not power the die before confirming supply voltage and pin map from the Renesas die design kit - bare dies have no keyed package to prevent mis-bonding, and an incorrect supply connection can destroy the part instantly. Also remember this is a die-sale item: incoming inspection (visual, electrical sample probing) should be planned, and only die-sale quantities of known-good die should be committed to production. ESD handling class 0 controls are mandatory; linear TIAs with 64Gbps inputs are extremely ESD-sensitive.
合規資訊
Compliance declarations not present in retrieved distributor data. For a bare-die product, request the Renesas material declaration for the GX36420 family. Bare die is not a packaged AEC-Q100 device.
