H58G46AK6QX033 vs H58G56AK6PX032N 比較
詳細並排比較 H58G46AK6QX033 由 SK hynix 與 H58G56AK6PX032N 由 SK hynix. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | H58G46AK6QX033 | H58G56AK6PX032N |
|---|---|---|
| 品牌 | SK hynix | SK hynix |
| 類別 | Mobile LPDDR4 | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | LPDDR5 (Low Power Double Data Rate 5) SDRAM | Volatile |
| Density | 16Gb (2 GB) | — |
| 組織 | x16 | 512M x 64 (x16 device configuration) |
| 資料速率 | 6400 Mbps per pin | 6400 Mbps per pin |
| Peak Bandwidth | 12.8 GB/s (x16 channel) | — |
| 介面 | LPDDR5 (JEDEC) | Parallel |
| Grade | Automotive | Automotive |
| 供應電壓 | [DATA_NEEDED: core/I-O supply voltage] | — |
| Package Type | FBGA (ball grid array) | — |
| Ball Count | [DATA_NEEDED: package ball count] | — |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature] |
| 安裝類型 | Surface Mount (soldered BGA) | Surface Mount |
| Application Domain | Automotive ADAS, infotainment, industrial computing | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS Status] |
| AEC-Q100 | [DATA_NEEDED: AEC-Q100 qualification level] | — |
| Refresh | [DATA_NEEDED: refresh scheme] | — |
| Memory Format | — | DRAM |
| Technology | — | LPDDR5 SDRAM |
| 記憶體容量 | — | 4 GB (32 Gb) |
| Supply Voltage (VDD2 / VDDQ / VDD1) | — | 1.8 V / 1.05 V / 0.5 V |
| 封裝 | — | 315-FBGA |
| Product Status | — | Active |
| Packaging | — | Tray |
| Clock Frequency | — | [DATA_NEEDED: Clock Frequency] |