IRFS52N15DTRLP vs IRFS4321TRLPBF 比較

詳細並排比較 IRFS52N15DTRLP 由 Infineon 與 IRFS4321TRLPBF 由 Infineon. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Infineon
IRFS52N15DTRLP IRFS52N15DTRLP - 150V 51A N-Channel HEXFET MOSFET D2PAK

IRFS52N15DTRLP - 150V 51A N-Channel HEXFET MOSFET D2PAK

IRFS52N15DTRLP ✓ 啟用中

規格比較

參數 IRFS52N15DTRLP IRFS4321TRLPBF
品牌 Infineon Infineon
類別 MOSFETs MOSFETs
生命週期狀態 啟用中 啟用中
FET Type N-Channel MOSFET N-Channel MOSFET, Metal Oxide
Technology HEXFET (Planar) IR HEXFET (IR MOSFET)
Drain-to-Source Voltage (Vdss) 150 V —
Continuous Drain Current (Id) @ TC = 25 C 51 A (Tc) —
Continuous Drain Current (Id) @ TC = 100 C 36 A (Tc, estimated) —
Continuous Drain Current (Id) @ TA = 25 C 60 A (Ta, datasheet) —
On-Resistance Rds(on) max @ VGS = 10 V 32 mOhm —
Gate Threshold Voltage (VGS(th)) 2.0 V to 4.0 V (typical 3 V) —
Total Gate Charge (Qg) [DATA_NEEDED: total gate charge in nC] —
Gate-to-Drain Charge (Qgd) [DATA_NEEDED: Qgd in nC] —
Input Capacitance (Ciss) [DATA_NEEDED: Ciss in pF] —
Power Dissipation (Pd) @ TC = 25 C 230 W (Tc) —
Power Dissipation (Pd) @ TA = 25 C 3.8 W (Ta) —
Thermal Resistance Junction-to-Case (RthJC) [DATA_NEEDED: RthJC in C/W] —
Thermal Resistance Junction-to-Ambient (RthJA) [DATA_NEEDED: RthJA in C/W] —
工作溫度範圍 -55 C to +175 C (junction) —
封裝 D2PAK (TO-263) surface mount TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
安裝類型 Surface Mount Surface Mount
腳位數 3 (Gate, Drain, Source) + tab —
RoHS 狀態 Compliant Compliant
Lead-Free Finish Yes (matte tin) —
MSL 等級 1 (per JEDEC J-STD-020, typical for D2PAK) —
Drain-to-Source Voltage (VDS) — 150 V
Continuous Drain Current (ID) at Tc=25C — 85 A
Continuous Drain Current (ID) at Tc=100C — [DATA_NEEDED: ID at Tc=100C]
Pulsed Drain Current (IDM) — [DATA_NEEDED: pulsed drain current]
RDS(on) Max at VGS=10V — 15 mOhm
RDS(on) Max at VGS=4.5V — [DATA_NEEDED: RDS(on) at VGS=4.5V]
Gate-to-Source Voltage (VGS) Max — ±20 V
Gate Threshold Voltage (VGS(th)) Typ — [DATA_NEEDED: VGS(th) typical]
Total Gate Charge (Qg) Typ — 71 nC
Total Gate Charge (Qg) Max — 110 nC
Power Dissipation (PD) at Tc=25C — 350 W
Thermal Resistance Junction-to-Case (RθJC) Max — 0.45 C/W
Thermal Resistance Junction-to-Case (RθJC) End-of-Life — 0.65 C/W (after 1000 cycles -55C to +150C)
工作接面溫度 — -55C to +175C

資料表與資源

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