K3K9K90BM-MGCP vs K3LKCKC0BM-MGCP 比較
詳細並排比較 K3K9K90BM-MGCP 由 Samsung Electronics 與 K3LKCKC0BM-MGCP 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K3K9K90BM-MGCP | K3LKCKC0BM-MGCP |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | LPDDR5 SDRAM (CMOS) | LPDDR5 SDRAM (DRAM) |
| 組織 | [DATA_NEEDED: density and organization] | — |
| Pin Speed | Up to 6400 Mbps (family maximum per Samsung LPDDR5 page) | — |
| Interface Width | x32 (family standard for K3K/K3L BM packages) | — |
| 封裝 | PBGA (Plastic Ball Grid Array) | FBGA-315 (PBGA315) |
| Ball Count | [DATA_NEEDED: ball count] | — |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | -25 C to +85 C |
| Supply Voltage (VDD) | [DATA_NEEDED: VDD voltage] | — |
| Refresh | Self-refresh with per-bank refresh support (LPDDR5 standard) | — |
| Power Saving vs LPDDR4X | Approximately 20% (Samsung published figure) | — |
| Max Bandwidth | Up to 51.2 GB/s (family maximum per Samsung LPDDR5 page) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Clocking | WCK (word clock) architecture | — |
| Standards | JEDEC LPDDR5 | — |
| 記憶體容量 | — | 64 Gbit |
| Memory Organization | — | 2G x32 |
| 資料速率 | — | 6400 Mbps |
| 介面 | — | Parallel |
| Technology | — | CMOS |
| Supply Voltages | — | 500 mV, 900 mV, 1.05 V, 1.8 V |
| Volatile / Non-Volatile | — | Volatile |
| Clock Frequency | — | [DATA_NEEDED: clock frequency] |
| Access Time | — | [DATA_NEEDED: access time] |
| Power Consumption - Active | — | [DATA_NEEDED: active power] |
| Power Consumption - Standby | — | [DATA_NEEDED: standby power] |
| MSL 等級 | — | [DATA_NEEDED: moisture sensitivity level] |