K3KL3L30QM-JGCT vs K3KL9L90DM-JGCT 比較
詳細並排比較 K3KL3L30QM-JGCT 由 Samsung Electronics 與 K3KL9L90DM-JGCT 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K3KL3L30QM-JGCT | K3KL9L90DM-JGCT |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | Volatile - DRAM | LPDDR5X SDRAM |
| Technology | LPDDR5X | — |
| 記憶體容量 | 64 Gb | — |
| Memory Organization | x64 | — |
| Maximum Data Rate | 7500 Mbps/pin | — |
| 介面類型 | Parallel LPDDR5X | — |
| Clock Rate | [DATA_NEEDED: clock rate] | — |
| Supply Voltage VDD | [DATA_NEEDED: VDD voltage] | — |
| Supply Voltage VDDQ | [DATA_NEEDED: VDDQ voltage] | — |
| Access Time / Latency | [DATA_NEEDED: CAS latency] | — |
| 封裝 | [DATA_NEEDED: package code and dimensions] | FBGA-315 |
| Ball Count | [DATA_NEEDED: ball count] | — |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | -25C to +85C |
| Product Status | Sampling (per distributor data) | — |
| Packaging | Plateau (tray style, per distributor data) | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant |
| Density | — | 16 Gbit |
| 資料速率 | — | [DATA_NEEDED: data rate for JGCT speed grade] |
| Supply Voltage (VDD) | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage (VDDQ) | — | [DATA_NEEDED: I/O supply voltage] |
| 組織 | — | [DATA_NEEDED: x organization] |
| Bank Architecture | — | [DATA_NEEDED: bank/group configuration] |
| 介面 | — | [DATA_NEEDED: channel configuration] |
| MSL 等級 | — | [DATA_NEEDED: moisture sensitivity level] |
| Package Dimensions | — | [DATA_NEEDED: body dimensions] |
| AEC-Q100 | — | [DATA_NEEDED: automotive qualification status] |