K3KL7L70EM-MGCU vs K3KL9L90DM-MGCU 比較
詳細並排比較 K3KL7L70EM-MGCU 由 Samsung Electronics 與 K3KL9L90DM-MGCU 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Samsung Electronics
K3KL7L70EM-MGCU - 12Gb LPDDR5X DRAM, 315-Ball FBGA | Samsung
K3KL7L70EM-MGCU ✓ 啟用中Samsung Electronics
K3KL9L90DM-MGCU - LPDDR5X 64Gb x32 8533Mbps FBGA | Samsung
K3KL9L90DM-MGCU ✓ 啟用中規格比較
| 參數 | K3KL7L70EM-MGCU | K3KL9L90DM-MGCU |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Manufacturer | Samsung Electronics | Samsung Electronics |
| 記憶體類型 | LPDDR5X SDRAM | LPDDR5X SDRAM |
| Density | 12 Gbit (1.5 GB) | — |
| 封裝 | 315-ball FBGA | 315-ball FBGA |
| 安裝類型 | Surface Mount | Surface Mount |
| Speed Grade Suffix | -MGCU | — |
| 資料速率 | [DATA_NEEDED: data rate Mbps/pin] | 8533 Mbps per pin |
| Supply Voltage VDD | [DATA_NEEDED: VDD core voltage] | — |
| Supply Voltage VDDQ | [DATA_NEEDED: VDDQ I/O voltage] | — |
| 組織 | [DATA_NEEDED: organization x32] | x32 |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | -25C to +85C |
| Bank Architecture | [DATA_NEEDED: bank group count] | — |
| CAS 延遲 | [DATA_NEEDED: CAS latency] | — |
| Refresh | Self-refresh and per-bank refresh per JEDEC LPDDR5X | — |
| Termination | On-Die Termination (ODT) | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant |
| MSL 等級 | [DATA_NEEDED: moisture sensitivity level] | — |
| Total Density | — | 64 Gbit (8 GB) |
| I/O Voltage Class | — | [DATA_NEEDED: VDDQ voltage] |
| Core Supply | — | [DATA_NEEDED: VDD voltage] |
| Standard | — | JEDEC LPDDR5X (LPDDR5 family) |
| Channel Configuration | — | 32-bit channel |
| Speed Class Designator | — | LPDDR5X-8533 |
| Density per Die | — | 16 Gbit per channel density (per distributor data) |