K3LKJKJ0CM-MUCP vs K3LK8K80CM-MFCP 比較
詳細並排比較 K3LKJKJ0CM-MUCP 由 Samsung Electronics 與 K3LK8K80CM-MFCP 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K3LKJKJ0CM-MUCP | K3LK8K80CM-MFCP |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | DRAM | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Manufacturer | Samsung Electronics | — |
| Product Type | LPDDR5 SDRAM | — |
| Density | 24 Gbit (3 GB) | 48 Gbit (6 GB) |
| 封裝 | 315-ball FBGA | 315-ball FBGA (MFCP) |
| Maximum Data Rate | 6400 Mbps | — |
| VDD2 Supply Voltage | 1.8 V | — |
| VDD1 Supply Voltage | 1.05 V | — |
| VDDQ Supply Voltage | 0.9 V | — |
| 介面 | LPDDR5 (JEDEC standard) | LPDDR5 (JESD209-5 class low-power DRAM interface) |
| Memory Category | DRAM (volatile memory) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| 組織 | [DATA_NEEDED: x-bit organization] | [DATA_NEEDED: organization (x width)] |
| 工作溫度 | [DATA_NEEDED: temperature range for -MUCP grade] | -40 C to +105 C (automotive-grade) |
| Product Status | Active (per Samsung LPDDR5 family listings) | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS compliance] | unknown |
| Automotive Qualification | [DATA_NEEDED: AEC-Q100 status for MUCP suffix] | — |
| 記憶體類型 | — | LPDDR5 SDRAM |
| Pin Speed | — | 6400 Mbps |
| Data Rate (package) | — | 51.2 GB/s (family max) |
| Ball Count | — | 315 |
| 供應電壓 | — | [DATA_NEEDED: VDD/VDDQ voltage] |
| Power Saving vs LPDDR4X | — | Approximately 20% |
| Generation | — | LPDDR5 (5th generation low-power DRAM) |
| Application Grade | — | Automotive-grade storage chip |
| Place of Origin | — | Johor, Malaysia |