K4AAG085WA-BCWE vs K4AAG085WA-BCTD 比較
詳細並排比較 K4AAG085WA-BCWE 由 Samsung Electronics 與 K4AAG085WA-BCTD 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K4AAG085WA-BCWE | K4AAG085WA-BCTD |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit | 16 Gbit (2 GB) |
| 組織 | 2G x 8 | 2G x 8 |
| 資料速率 | 3200 Mbps (DDR4-3200) | 2666 Mbps |
| 供應電壓 | 1.2 V | 1.2 V |
| Operating Voltage Range | 1.14 V to 1.26 V | — |
| 工作溫度 | 0 C to 85 C | 0C to +85C |
| 封裝 | 78-ball FBGA (9 x 11 mm, 0.8 mm pitch) | 78-ball FBGA (78FBGA) |
| 安裝類型 | Surface Mount | Surface Mount |
| 介面 | JEDEC DDR4 | DDR4 parallel, JEDEC DDR4 ballout |
| Memory Width | 8-bit | — |
| Refresh | Auto-refresh (per JEDEC DDR4) | — |
| Application Class | Main memory / embedded DRAM | — |
| RoHS 狀態 | Compliant (per JLCPCB listing) | Compliant |
| Manufacturer | Samsung Electronics | — |
| Speed Grade | — | DDR4-2666 (-BCTD) |
| Bank Architecture | — | 16 banks in 4 bank groups (DDR4 standard) |
| Burst Length | — | BL8 (DDR4 standard) |
| Application Domain | — | Computing, networking, industrial memory |
| Manufacturing Standard | — | JEDEC DDR4 SDRAM |
| Lead Time / Stock | — | [DATA_NEEDED: current stock status] |