K4RBH165VB-BCQK vs K4RAH086VB-BCQK 比較
詳細並排比較 K4RBH165VB-BCQK 由 Samsung Electronics 與 K4RAH086VB-BCQK 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K4RBH165VB-BCQK | K4RAH086VB-BCQK |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | DRAM |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 庫存狀態 | — | In Stock |
| 單價 (USD) | — | $41.02 |
| 記憶體類型 | DDR5 SDRAM | DDR5 SDRAM (Volatile DRAM) |
| 記憶體容量 | 16 Gb | 16 Gb |
| 組織 | 1G x 16 | — |
| 資料速率 | 4800 Mbps/pin | 4800 Mbps |
| Speed Grade | BCQK (4800 Mbps) | — |
| 工作溫度 | 0 C to +85 C | [DATA_NEEDED: operating temperature range] |
| Self Refresh | Auto self-refresh | — |
| Reset Function | Asynchronous reset | — |
| Error Correction | On-chip (on-die) ECC | — |
| Write Leveling | Yes | — |
| CRC Function | Yes | — |
| ZQ Calibration | Yes | — |
| 供應電壓 | [DATA_NEEDED: core supply voltage (VDD), nominally 1.1 V for DDR5] | 1.1 V |
| Package Type | [DATA_NEEDED: exact package code, expected FBGA surface mount] | — |
| 安裝類型 | Surface Mount | Surface Mount |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Burst Length | [DATA_NEEDED: burst length (BL16 per DDR5 standard)] | — |
| Memory Organization | — | 2G x 8 |
| 介面 | — | Parallel |
| Technology | — | DDR5 |
| ECC | — | On-die ECC |
| 封裝 | — | FBGA-82 |
| Product Status | — | Active |
| Operating Mode | — | DLL Enabled mode |
| Series | — | K4RAH0x6VB (DDR5 16Gb B-die family) |
| Packaging | — | Tray |
| Refresh Rate | — | [DATA_NEEDED: refresh specification] |