K9UMGB8U7M vs K9HCG08U1M 比較
詳細並排比較 K9UMGB8U7M 由 Samsung Electronics 與 K9HCG08U1M 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K9UMGB8U7M | K9HCG08U1M |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | NAND Flash | — |
| Manufacturer | Samsung Electronics | — |
| Family | K9U series NAND Flash | — |
| Data Interface | [DATA_NEEDED: Data Interface] | — |
| Density | [DATA_NEEDED: Memory Density] | — |
| 組織 | [DATA_NEEDED: Memory Organization] | 8G x 8 |
| Cell Type | [DATA_NEEDED: Cell Type (SLC/MLC/TLC)] | — |
| 供應電壓 | [DATA_NEEDED: Supply Voltage] | [DATA_NEEDED: supply voltage] |
| Page Size | [DATA_NEEDED: Page Size] | [DATA_NEEDED: page size] |
| Block Size | [DATA_NEEDED: Block Size] | [DATA_NEEDED: block size] |
| Read Time | [DATA_NEEDED: Read Time] | — |
| Program Time | [DATA_NEEDED: Program Time] | — |
| Endurance | [DATA_NEEDED: Program/Erase Cycles] | — |
| 工作溫度 | [DATA_NEEDED: Operating Temperature Range] | -40C to +105C (TA) |
| 封裝 | [DATA_NEEDED: Package Type] | TSOP-48 (PDSO48) |
| 安裝類型 | [DATA_NEEDED: Mounting Type] | Surface Mount |
| RoHS 狀態 | [DATA_NEEDED: RoHS Status] | — |
| Memory Technology | — | MLC NAND Flash |
| Total Capacity | — | 64 Gbit |
| 資料匯流排寬度 | — | 8 bit |
| 介面類型 | — | Asynchronous NAND (multiplexed address/data/command) |
| Read Time (tR) | — | [DATA_NEEDED: read time] |
| Program Time (tPROG) | — | [DATA_NEEDED: program time] |
| Program/Erase Cycles | — | [DATA_NEEDED: endurance] |
| Ready/Busy Output | — | Yes (R/B#) |
| Die Technology | — | Samsung E-die (per datasheet family) |
| Full Ordering Code | — | K9HCG08U1M-PCB0 / K9HCG08U1M-PCB0T00 |