M1AFS250-1FGG256I vs M1AFS250-2FGG256I 比較

詳細並排比較 M1AFS250-1FGG256I 由 Microchip Technology 與 M1AFS250-2FGG256I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
M1AFS250-1FGG256I M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I ✓ 啟用中
Microchip Technology
M1AFS250-2FGG256I M1AFS250-2FGG256I - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip

M1AFS250-2FGG256I - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip

M1AFS250-2FGG256I ✓ 啟用中

規格比較

參數 M1AFS250-1FGG256I M1AFS250-2FGG256I
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Series M1AFS250 (Fusion) —
System Gates 250,000 gates 250000 gates
Logic Cells 6144 —
Total SRAM/Flip-Flop Bits (DigiKey listing) 36864 —
Number of I/O 114 —
Maximum System Frequency 350 MHz —
Processor Core ARM Cortex-M1 (optional ARM support, M1 variant) —
Technology 130-nm, 7-layer metal, flash-based CMOS —
Configuration Memory Nonvolatile flash (Live at Power-Up, LAPU) —
Security 128-bit flash-based lock, AES decryption 128-bit Flash lock, AES decryption
工作電源電壓 1.5 V —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
封裝 / 外殼 256-LBGA (FBGA), 1.00 mm ball pitch —
安裝方式 SMD/SMT —
Packaging Tray —
Mixed-Signal Features Configurable analog, flash memory blocks, clock generation and management —
RoHS 狀態 [DATA_NEEDED: RoHS status] Compliant (FGG = Pb-free balls)
Moisture Sensitivity Level [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
Family — Actel Fusion (Mixed-Signal FPGA)
Registers (DFFs) — 36864
User I/Os — 114
Embedded Processor — ARM Cortex-M1
Configuration Technology — Flash-based, nonvolatile
Process Technology — 130 nm, 7-layer metal CMOS
System Performance — Up to 350 MHz
Speed Grade — -2
Core Supply Voltage — 1.5 V
封裝 — 256-ball FBGA (FGG256)
安裝類型 — Surface Mount
工作溫度 — -40C to +85C (industrial, I grade)
Power-Up Behavior — Live at Power-Up (LAPU)

資料表與資源

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