M1AFS250-FG256 vs M1AFS250-FGG256 比較
詳細並排比較 M1AFS250-FG256 由 Microchip Technology 與 M1AFS250-FGG256 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
M1AFS250-FG256 - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
M1AFS250-FG256 ✓ 啟用中Microchip Technology
M1AFS250-FGG256 - 250K-Gate Fusion Mixed-Signal FPGA | Microchip
M1AFS250-FGG256 ✓ 啟用中規格比較
| 參數 | M1AFS250-FG256 | M1AFS250-FGG256 |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Manufacturer Part Number | M1AFS250-FG256 | — |
| Family | Fusion (M1 series, ARM Cortex-M1) | Fusion (M1 series, mixed-signal FPGA) |
| System Gates | 250000 | 250,000 |
| Logic Cells | 6144 | 6144 |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 (M1 variants) |
| 最大時脈頻率 | 350 MHz | 350 MHz |
| Number of I/O | 114 | — |
| RAM Bits | 36864 | — |
| Process Technology | 130 nm | — |
| Core Supply Voltage | 1.5 V | — |
| Configuration Memory | Flash (nonvolatile) | Flash-based, live at power-up |
| 工作溫度範圍 | 0C to +70C | — |
| 封裝 / 外殼 | 256-FBGA (256-LBGA), 1.00 mm pitch | — |
| 安裝方式 | SMD/SMT | — |
| Packaging | Tray | — |
| RoHS 狀態 | RoHS Non-Compliant (contains lead) | RoHS Compliant |
| Lead Free Status | Contains Lead | Lead Free |
| Series | M1AFS250 | — |
| User I/O | — | 114 |
| Flash Memory Bits | — | 36864 |
| Technology | — | CMOS |
| 封裝 | — | 256-LBGA (FGG256), 1.0 mm ball pitch |
| 安裝類型 | — | Surface Mount |
| 工作溫度 | — | [DATA_NEEDED: operating temperature range] |
| 供應電壓 | — | [DATA_NEEDED: core supply voltage] |
| Analog Peripherals | — | Configurable analog (voltage/temperature monitoring) |
| Clock Management | — | On-chip clock generation and management circuitry |