M7AFS600-1FGG256I vs M7AFS600-FGG256 比較
詳細並排比較 M7AFS600-1FGG256I 由 Microchip Technology 與 M7AFS600-FGG256 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ 啟用中Microchip Technology
M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip
M7AFS600-FGG256 ✓ 啟用中規格比較
| 參數 | M7AFS600-1FGG256I | M7AFS600-FGG256 |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Fusion (Mixed-Signal Flash FPGA) | Fusion (M7AFS600) |
| System Gates | 600K | 600K |
| Processor Core | ARM CoreMP7 | — |
| Number of I/O | 119 | — |
| 工作電源電壓 | 1.5 V | — |
| Process Technology | 130 nm, 7-layer metal flash-based CMOS | 130 nm flash-based |
| Configuration Memory | Flash (nonvolatile) | Flash (single-chip, non-volatile) |
| System Performance | Up to 350 MHz | — |
| Speed Grade | -1 | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| 封裝 / 外殼 | 256-Ball FBGA (FGG256) | — |
| 安裝方式 | SMD/SMT | — |
| Packaging | Tray | Tray |
| Series | M7AFS600 | — |
| Live at Power-Up (LAPU) | Yes | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| Analog Subsystem | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) | — |
| Flip-Flops | — | 110592 |
| User I/O | — | 119 |
| Embedded Processor | — | ARM CoreMP7 |
| Core Supply Voltage | — | 1.5 V |
| Maximum Frequency | — | 1098.9 MHz (distributor listing) |
| 封裝 | — | 256-LBGA / 256-FBGA |
| Ball Pitch | — | 1 mm |
| 安裝類型 | — | Surface Mount |
| Analog Features | — | Integrated configurable analog blocks, clock generation and management |
| 工作溫度 | — | [DATA_NEEDED: Operating Temperature Range] |
| MSL 等級 | — | [DATA_NEEDED: Moisture Sensitivity Level] |