M7AFS600-FG256I vs A3P600-FG256 比較
詳細並排比較 M7AFS600-FG256I 由 Microchip Technology 與 A3P600-FG256 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-FG256I ✓ 啟用中Microchip Technology
A3P600-FG256 - ProASIC3 Flash FPGA 600K Gates 256-BGA | Microchip
A3P600-FG256 ✓ 啟用中規格比較
| 參數 | M7AFS600-FG256I | A3P600-FG256 |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Series | M7AFS600 (Fusion) | — |
| System Gates | 600K | 600000 |
| Logic Capacity (DigiKey listing) | 110592 | — |
| Number of I/O | 119 I/O | — |
| Embedded Processor | ARM CoreMP7 | — |
| Core Supply Voltage | 1.5 V | 1.425 V to 1.575 V (1.5 V nominal) |
| Process Technology | 130 nm | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| 封裝 / 外殼 | 256-LBGA (FBGA) | — |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| 安裝方式 | SMD/SMT | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Packaging | Tray | Tray |
| Programmable Logic Type | Flash-based, non-volatile | — |
| Analog Integration | Mixed-signal (configurable analog + flash memory) | — |
| Family | — | ProASIC3 (Flash FPGAs) |
| Logic Elements | — | 7K LEs (VersaTiles) |
| Embedded SRAM | — | 110592 bits (True Dual-Port) |
| User I/O | — | 177 |
| Maximum System Performance | — | Approx. 231 MHz |
| Configuration Technology | — | On-chip flash, reprogrammable, single-chip |
| Power-Up Behavior | — | Instant On Level 0 support |
| 封裝 | — | 256-LBGA / FBGA (17x17 mm, 1 mm pitch) |
| 安裝類型 | — | Surface Mount |
| 工作溫度 | — | 0 C to 85 C (TJ) |
| I/O Banks | — | 4 (independent VCCIBx supplies) |
| RoHS 狀態 | — | RoHS non-compliant (per Microchip USA listing) |
| Manufacturer Lead Time | — | 8 weeks |