MC68334GEH16 vs MC68376BGVAB25 比較

詳細並排比較 MC68334GEH16 由 NXP Semiconductors 與 MC68376BGVAB25 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC68376BGVAB25 MC68376BGVAB25 - 32-bit CPU32 MCU 25MHz ROMless 160-QFP | NXP

MC68376BGVAB25 - 32-bit CPU32 MCU 25MHz ROMless 160-QFP | NXP

MC68376BGVAB25 ⚠ 最後購買機會

規格比較

參數 MC68334GEH16 MC68376BGVAB25
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND 最後購買
Core CPU32 (M68300 family) CPU32 (32-bit, M68000-family)
Architecture 32-bit CISC, 68000-derived —
Maximum CPU Frequency 16 MHz —
Program Memory ROMless (external memory required) ROMless (external memory required)
On-chip RAM 1 KB —
Time Processing Unit (TPU) Yes (on-chip) —
System Integration Module (SIM) Yes (on-chip, with chip-select logic and DRAM refresh) —
External Data Bus 16-bit —
External Address Bus 24-bit (16 MB linear) —
封裝 132-pin PQFP (24.13 x 24.13 mm) —
安裝類型 Surface Mount Surface Mount
工作電源電壓 5 V (typical, VCC range [DATA_NEEDED: full range]) —
工作溫度範圍 [DATA_NEEDED: industrial or automotive grade] —
I/O Voltage 5 V CMOS —
RoHS 狀態 [DATA_NEEDED: lot-dependent; earlier PQFP runs often non-RoHS] Non-compliant (legacy QFP)
Lead-Free [DATA_NEEDED: lot-dependent] —
MSL 等級 [DATA_NEEDED] [DATA_NEEDED]
Family — M683xx
Operating Frequency — 25 MHz
RAM Size — 7.5K x 8
Number of I/O — 18
Oscillator Type — External
封裝 / 外殼 — 160-BQFP (28x28 mm, 0.65 mm pitch)
Peripherals — Queued Serial Module, TPU, CANSAP, SIM
供應電壓 — 5 V nominal
工作溫度 — -40C to +105C (industrial / automotive grade)
Lead Free — No (contains lead, SnPb ball finish)

資料表與資源

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