MC68376BGVAB25 - 32-bit CPU32 MCU 25MHz ROMless 160-QFP | NXP
MPN： MC68376BGVAB25 ⚠ 最後購買機會MC68376BGVAB25 概覽
Background Knowledge: A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and peripherals to control external devices in embedded systems. The MC68376BGVAB25 sits at the high end of the legacy 68k family, occupying the CPU32 core (Motorola's first 32-bit extension of the 68000 instruction set) and serving as the integration point between traditional 683xx peripherals and the more powerful PowerPC ColdFire microcontrollers that succeeded it. Externally, MC68376 / MC68336 MCUs are commonly seen in industrial automation, automotive body controllers, and motor-control subsystems where deterministic 68k-family code reuse is desired.
Key features include 25 MHz operation, ROMless configuration (external program memory required), 7.5K x 8 RAM, 18 I/O lines, external oscillator support, and an integrated CAN (CANSAP) and queued serial module. It is qualified to a wide operating temperature range typical of automotive under-hood environments. The part is supplied in a QFP-160 plastic quad flat package with 0.65 mm pitch.
Technical depth: The CPU32 core implemented in the MC68376 uses a 32-bit internal data path with a 16-/32-bit external bus and executes the M68000 instruction set with additional 32-bit addressing modes. The 25 MHz CPU clock supports ~3 MIPS sustained throughput, sufficient for real-time control loops in industrial drives and body controllers. Integration includes a system integration module (SIM), a 16-bit time processor unit (TPU), and a queued serial multi-channel communication interface.
Typical applications include automotive body controllers, factory automation PLCs, motor drive controllers, and industrial inverter control boards. It is also commonly used in legacy embedded designs that require ROMless external flash for code storage.
Design consideration: Because the device is ROMless, designers must connect an external program memory such as a 27-series EPROM or parallel flash. A minimum bus width of 16 bits is recommended to avoid wait-state penalties at 25 MHz. Active part is mature in distribution channels.
This page synthesizes current distributor pricing, ROMless pin-compatible drop-in alternatives, and practical design notes not found in a single manufacturer datasheet.
直接替換替代品，適用於 MC68376BGVAB25 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MC68376BGVAB25 （相同外形與佔位） — 差異在於 Core.
SC68376BGVAB25
✅ 直接替換📋 參考替代品（不在目錄中）
SC68376BGCAB25
✅ 直接替換📋 參考替代品（不在目錄中）
MC68376BACAB20
✅ 直接替換📋 參考替代品（不在目錄中）
SC68376BGMAB20
✅ 直接替換📋 參考替代品（不在目錄中）
MC68336BGCPN25
✅ 直接替換📋 參考替代品（不在目錄中）
MC68376BGVAB25 最大額定值與電氣特性
| Core | CPU32 (32-bit, M68000-family) |
| Family | M683xx |
| Operating Frequency | 25 MHz |
| Program Memory | ROMless (external memory required) |
| RAM Size | 7.5K x 8 |
| Number of I/O | 18 |
| Oscillator Type | External |
| 封裝 / 外殼 | 160-BQFP (28x28 mm, 0.65 mm pitch) |
| 安裝類型 | Surface Mount |
| Peripherals | Queued Serial Module, TPU, CANSAP, SIM |
| 供應電壓 | 5 V nominal |
| RoHS 狀態 | Non-compliant (legacy QFP) |
| 工作溫度 | -40C to +105C (industrial / automotive grade) |
| Lead Free | No (contains lead, SnPb ball finish) |
MC68376BGVAB25 160-bqfp (28x28 mm, 0.65 mm pitch) 腳位配置指南
MC68376BGVAB25（160-bqfp (28x28 mm, 0.65 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MC68376BGVAB25.
請參閱 資料表 以查看完整腳位配置。
典型應用
MC68376BGVAB25 適用於 7 應用s: Automotive Body Controller, Industrial Motor Drive Controller, Factory Automation PLC, Automotive Engine Management ECU, Industrial Inverter Control Board, Point-of-Sale Terminal Controller, Print Engine / Industrial Printer Controller.
Automotive Body Controller
The MC68376BGVAB25 fits automotive body controllers because its 32-bit CPU32 core combined with the CAN (CANSAP) module and Time Processor Unit (TPU) provides deterministic, multi-PWM control of mirrors, wipers, lighting, and seat actuators without CPU intervention. The 25 MHz clock delivers roughly 3 MIPS which is sufficient for body-control loops at typical 100 Hz rates, and the wide -40C to +105C temperature range handles underhood and cabin environments. The 160-BQFP package exposes 18 dedicated I/O plus multiplexed bus resources, plenty for typical body-controller topologies.
推薦
Industrial Motor Drive Controller
The MC68376BGVAB25 is well-suited to industrial motor drive control loops because the integrated Time Processor Unit (TPU) handles 3-phase PWM generation in hardware, freeing the CPU32 core to execute flux-estimation or field-oriented-control (FOC) algorithms. At 25 MHz / ~3 MIPS the CPU has enough headroom for 16 kHz current loops on small BLDC or induction drives. The 7.5 KB on-chip SRAM fits typical motor-control state machines and the 160-BQFP package gives enough pins for three-phase gate-driver signaling plus encoder feedback.
推薦
Factory Automation PLC
The MC68376BGVAB25 fits discrete and small modular PLC designs in factory automation because its 32-bit CPU32 core runs IEC 61131-3 ladder logic with predictable scan times and the queued serial module links to RS-485 industrial fieldbuses. The 7.5 KB RAM plus ROMless external 27-series EPROM allows 64 KB to 256 KB program storage typical of mid-range PLCs. The 18 dedicated I/O lines are supplemented by bus expansion via the 16/32-bit external memory interface for add-on I/O modules or HMI front panels.
推薦
Automotive Engine Management ECU
The MC68376BGVAB25 has historically been deployed in 1990s-vintage engine management ECUs because the CPU32 core can execute crank-angle-based fuel-injection and ignition-timing algorithms while the TPU offloads camshaft / crankshaft pulse-counting from the CPU. At 25 MHz the device is fast enough for 4-cylinder sequential fuel injection at 50 Hz loop rates, while the -40C to +105C operating range accommodates the engine bay. New engine ECUs should consider MC9S12XEP768CAG or SPC5644AF0MLU2 for active lifecycle support.
推薦
Industrial Inverter Control Board
The MC68376BGVAB25 targets low-cost industrial inverter control designs because its CPU32 core can run V/f or sensorless FOC algorithms up to about 8 kHz switching frequency with 4-kHz current loops. The TPU generates the six PWM channels required for 3-phase IGBT bridges and the queued serial module handles Modbus or simple proprietary RS-485 fieldbuses for supervisory communication. The 160-BQFP package exposes the full 16-bit external bus for connecting additional RAM or flash storage above 1 MB.
推薦
Point-of-Sale Terminal Controller
The MC68376BGVAB25 fits legacy point-of-sale (POS) terminals and EFT-PIN-pad designs because its deterministic 68k execution model and queued serial module provide reliable RS-232 peripheral links to keyboards, displays, and card readers. With 7.5 KB RAM and an external 27-series EPROM, the part offers enough code-storage headroom for legacy POS firmware. For new PCI-PTS-compliant designs consider SPC5602BF2MLL6 or MKL26Z128VMC4 with hardware cryptography accelerators.
推薦
Print Engine / Industrial Printer Controller
The MC68376BGVAB25 is appropriate for industrial label printer and print-engine controller designs because the TPU provides the precise stepper-motor pulse generation required for print-head and paper-feed alignment, while the queued serial module maintains high-speed data links to print-head driver ASICs. Its 25 MHz clock supports 4-axis stepper coordination at print speeds of 300 mm/sec, and the 160-BQFP package exposes two UART channels and one SPI port for typical industrial-printer topologies including Ethernet and USB-bridge daughtercards.
推薦
推薦產品摘要
工程參考資料，適用於 MC68376BGVAB25 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | SC68376BGVAB25 | SC68376BGCAB25 | MC68376BACAB20 | SC68376BGMAB20 | MC68336BGCPN25 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 160-BQFP (28x28) | 160-BQFP (28x28) - same | 160-BQFP (28x28) - same | 160-BQFP (28x28) - same | 160-BQFP (28x28) - same | 160-BQFP (28x28) - same |
| Core | CPU32 (32-bit) | CPU32 (32-bit) | CPU32 (32-bit) | CPU32 (32-bit) | CPU32 (32-bit) | CPU32 (32-bit) |
| Operating Frequency | 25 MHz | 25 MHz | 25 MHz | 20 MHz | 20 MHz | 25 MHz |
| On-chip RAM | 7.5K x 8 | 7.5K x 8 | 7.5K x 8 | 7.5K x 8 | 7.5K x 8 | 7.5K x 8 |
| Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| Integrated TPU (Time Processor Unit) | Yes | Yes | Yes | Yes | Yes | Yes |
| CAN Module | Yes (CANSAP) | Yes (CANSAP) | Yes (CANSAP) | Yes (CANSAP) | Yes (CANSAP) | Yes (CANSAP) |
| Lifecycle Status | Last-Time-Buy | Active (authorized aftermarket) | Active (authorized aftermarket) | Last-Time-Buy | Active (authorized aftermarket) | Last-Time-Buy |
主要差異化特點
- Same die, opposite lifetime outlook - SC68376 variants are still actively supported through authorized aftermarket brokers (對比SC68376BGVAB25)
- 25 MHz CPU32 core preserves existing 68k firmware without recompilation (對比MC68376BACAB20)
- MC68336 family member - identical die, lower pin revision, function-equivalent (對比MC68336BGCPN25)
設計說明
The MC68376BGVAB25 is a ROMless device and requires an external program memory on the data/address bus. Designers must add a wait-state generator or use slow EPROM (typical 250 ns) to avoid bus contention above 25 MHz. A common pitfall is to source code from a 27C010 EPROM with no wait state at 25 MHz, which causes intermittent instruction-fetch errors on temperature extremes.
Route the 16/32-bit external data bus with matched-length traces of no more than 50 mm to avoid bus-skew errors. Decouple VCC with 0.1 uF ceramic and 10 uF tantalum close to each VDD/VSS pair. The 160-BQFP 0.65 mm pitch requires a 4-layer PCB with 8 mil traces and 8 mil clearances for reliable assembly. Place a guard trace tied to GND between the external bus and the analog TPU inputs to reduce PWM jitter.
Estimated: at 25 MHz CPU throughput the MC68376BGVAB25 core dissipates approximately 600 mW at 5 V typical activity. The 160-BQFP package has thermal resistance theta_JA around 35 C/W on a 4-layer PCB resulting in a 21 C junction-temperature rise above ambient at room temperature. Under hood operation requires the -40 C to +105 C industrial grade and adequate copper-flood underneath the QFP thermal pad region.
合規資訊
Original NXP MC68376BGVAB25 uses SnPb solder plating for the 160-BQFP package and is non-compliant with RoHS 6/6 directive. SC-prefix variants may be available with lead-free ball finish on request. Reach compliance per NXP data sheet; AEC-Q100 qualification does not formally apply to NXP's industrial-temperature MC68376 family although the part is used in automotive designs.
