MC9S08AW32CFGE vs MC9S08AW60CFGE 比較
詳細並排比較 MC9S08AW32CFGE 由 NXP Semiconductors 與 MC9S08AW60CFGE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MC9S08AW32CFGE | MC9S08AW60CFGE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | NRND |
| Core Processor | S08 (HCS08) 8-bit CISC | S08 (HCS08) 8-bit CISC |
| Core Size | 8-bit | 8-Bit |
| Maximum CPU Frequency | 40 MHz | 40 MHz |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Flash Memory | 32 KB (32K x 8) | 60 KB (60K x 8) |
| RAM | 2 KB | — |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| ADC Resolution | 10-bit | 10-bit, 8-channel |
| ADC Channels | 8-channel | — |
| General Purpose I/O | 34 | — |
| 封裝 | 44-LQFP (10x10 mm), 0.5 mm pitch | 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 |
| Package Standard | MO-220VKKD-2, 7 x 7 mm body variants per distributor listing | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Instruction Set | HC08 instruction set with added BGND instruction | HC08 instruction set with added BGND instruction |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| 生命週期狀態 | NRND (Not Recommended for New Designs) | NRND (Not Recommended for New Designs) per NXP |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | — |
| RAM Size | — | [DATA_NEEDED: RAM size] (Mouser listing states 4K; FindIC overview states 2K) |
| I/O Count | — | 38 general-purpose I/O |
| Supply Voltage Nominal | — | 3.3 V / 5 V |
| Packaging | — | Tray |
| Family | — | MC9S08AW (S08AW series) |