MC9S08AW32CFGE vs S908GR8E0CDWE 比較
詳細並排比較 MC9S08AW32CFGE 由 NXP Semiconductors 與 S908GR8E0CDWE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
S908GR8E0CDWE - 8-bit HC08 MCU, 8KB Flash, 8MHz | NXP / Freescale
S908GR8E0CDWE ✓ 啟用中規格比較
| 參數 | MC9S08AW32CFGE | S908GR8E0CDWE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | 啟用中 |
| Core Processor | S08 (HCS08) 8-bit CISC | — |
| Core Size | 8-bit | — |
| Maximum CPU Frequency | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | — |
| Flash Memory | 32 KB (32K x 8) | — |
| RAM | 2 KB | — |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| ADC Resolution | 10-bit | — |
| ADC Channels | 8-channel | — |
| General Purpose I/O | 34 | — |
| 封裝 | 44-LQFP (10x10 mm), 0.5 mm pitch | — |
| Package Standard | MO-220VKKD-2, 7 x 7 mm body variants per distributor listing | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Debug Interface | Single-wire background debug mode (BDM) | — |
| Instruction Set | HC08 instruction set with added BGND instruction | — |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | — |
| 生命週期狀態 | NRND (Not Recommended for New Designs) | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Core Architecture | — | HC08 (M68HC08 family) |
| 資料匯流排寬度 | — | 8-bit |
| Program Memory Size | — | 7.5 KB (7.5K x 8) FLASH |
| Maximum CPU Clock Frequency | — | 8 MHz |
| Operating Supply Voltage Range | — | Up to 5.5 V (typical 5 V) |
| 工作溫度範圍 | — | -40 °C to +85 °C |
| 封裝 / 外殼 | — | 28-SOIC (SOP-28) |
| Terminal Form | — | GULL WING |
| Number of Terminals | — | 28 |
| Package Code | — | SOP |
| Package Shape | — | RECTANGULAR |
| Automotive Qualified | — | Yes |
| MSL 等級 | — | [DATA_NEEDED: MSL level] |