MC9S08AW48CPUE vs MC9S08AW60CPUE 比較
詳細並排比較 MC9S08AW48CPUE 由 NXP Semiconductors 與 MC9S08AW60CPUE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MC9S08AW48CPUE | MC9S08AW60CPUE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | 啟用中 |
| Core Processor | S08 (HCS08) 8-bit CISC | S08 (HCS08) |
| Core Size | 8-bit | 8-Bit |
| CPU Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Program Memory Type | FLASH | — |
| Program Memory Size | 48 KB (48K x 8) | — |
| RAM Size | [DATA_NEEDED: RAM size] | 4 KB |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| I/O Count | 38 | 38 |
| Package Type | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2) | — |
| Package Height | 1 mm | — |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature Range] |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Instruction Set | HC08 with added BGND instruction | HC08 (CISC) with added BGND instruction |
| Packaging | Tray | — |
| 生命週期狀態 | NRND (Not Recommended for New Designs) | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | — |
| Speed (CPU Clock) | — | 40 MHz |
| Flash Memory | — | 60 KB (60K x 8) |
| Peripherals | — | 16-bit timer, ADC, SCI, SPI, multiple power-saving modes |
| ADC | — | 10-bit |
| 封裝 | — | 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height) |
| Life Cycle Stage | — | Active |
| Programmable Memory Type | — | Flash |
| Family | — | HCS08 (S08AW) |