MC9S08JM60CQH vs MC9S08DN32AMLC 比較

詳細並排比較 MC9S08JM60CQH 由 NXP Semiconductors 與 MC9S08DN32AMLC 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S08JM60CQH MC9S08JM60CQH - 8-bit S08JM MCU, 60KB Flash, USB, 64-QFP | NXP

MC9S08JM60CQH - 8-bit S08JM MCU, 60KB Flash, USB, 64-QFP | NXP

MC9S08JM60CQH ✓ 啟用中
NXP Semiconductors
MC9S08DN32AMLC MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC Nrnd

規格比較

參數 MC9S08JM60CQH MC9S08DN32AMLC
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 NRND
Core HCS08 (8-bit) HCS08 (S08)
Core Clock Frequency 48 MHz —
Internal Bus Frequency 24 MHz —
Program Memory (FLASH) 60 KB (60K x 8) —
RAM 4 KB 1.5 KB (1.5K x 8)
Operating Voltage Range 2.7 V to 5.5 V —
封裝 64-QFP (14x14 mm) 32-LQFP (7x7 mm)
腳位數 64 —
安裝類型 Surface Mount (QFP) Surface Mount
USB USB 2.0 Full-Speed Device (on-chip transceiver) —
GPIOs 51 —
ADC 8-channel, 12-bit 12-bit, up to 16 channels, 2.5 us conversion
Analog Comparators 2 —
Timers 16-bit modulo timer + RTC —
Communication USB, SCI (UART), SPI, I2C —
Debug Interface Background Debug Mode (BDM) + on-chip ICE Background Debug Mode (BDM)
Low-Power Modes STOP, WAIT, RUN —
工作溫度範圍 [DATA_NEEDED: operating temperature range] —
RoHS 狀態 Compliant Compliant
Instruction Set HC08 with added BGND HC08 with BGND
CPU Frequency — 40 MHz
Bus Frequency — 20 MHz
Program Memory (Flash) — 32 KB (32K x 8)
EEPROM — Embedded
Number of I/O — 25
CAN (MSCAN) — CAN 2.0 A/B
Serial Interfaces — SCI (UART), SPI, I2C
工作溫度 — -40 C to +125 C
供應電壓 — [DATA_NEEDED: VDD range]
Packaging — Tray
Oscillator Type — External

資料表與資源

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