MC9S08PA16VTG vs MC9S08QD4CSC 比較
詳細並排比較 MC9S08PA16VTG 由 NXP Semiconductors 與 MC9S08QD4CSC 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MC9S08PA16VTG | MC9S08QD4CSC |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | 停產終止 |
| Core Processor | S08 | S08 (HCS08), 8-bit CISC |
| Core Size | 8-Bit | 8-bit |
| Maximum CPU Speed | 20 MHz | — |
| Program Memory Size | 16 KB (16K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 2 KB | — |
| EEPROM Size | 256 bytes | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O | 14 | — |
| Connectivity | I2C, LINbus, SPI, UART/USART | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| ADC | 10-bit, multi-channel | — |
| 工作溫度範圍 | -40C to +105C | — |
| 封裝 | 16-TSSOP (0.173, 4.40 mm Width) | 8-SOIC |
| 安裝類型 | Surface Mount | Surface Mount |
| 生命週期狀態 | NRND (Not Recommended for New Designs) | — |
| 最大時脈頻率 | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| 供應電壓 | — | 3.3 V / 5 V |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Debug Interface | — | Background debugging system (single-wire BDM) |
| Packaging | — | Tube |
| 工作溫度 | — | [DATA_NEEDED: operating temperature range] |
| Life Cycle Stage | — | End of Life (per NXP product page) |