MC9S08SH4MFK vs MC9S08SH4MPJ 比較
詳細並排比較 MC9S08SH4MFK 由 NXP Semiconductors 與 MC9S08SH4MPJ 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MC9S08SH4MFK | MC9S08SH4MPJ |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | 停產終止 |
| Core | HCS08 (8-bit) | HCS08 (enhanced 8-bit) |
| Program Memory Size | 4 KB (4K x 8) Flash | — |
| RAM Size | 256 B | — |
| Maximum CPU Clock | 40 MHz | — |
| Number of I/O Pins | 17 | — |
| 封裝 / 外殼 | 24-VFQFN Exposed Pad (4x4 mm) | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| ADC | 12-channel, 10-bit, 2.5 us conversion | 12-channel, 10-bit, 2.5 us conversion time |
| Oscillator Type | Internal | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Instruction Set | HC08 with BGND instruction | — |
| Packaging | Tray | — |
| 安裝類型 | Surface Mount | Through-Hole (THT) |
| 工作溫度 | -40 C to +85 C (industrial, [DATA_NEEDED: confirm exact grade]) | -40C to +125C (automotive grade) |
| Compliance | RoHS compliant ([DATA_NEEDED: confirm exact status]) | — |
| CPU Architecture | — | CISC, HC08 instruction set with BGND |
| Maximum Bus Frequency | — | 40 MHz |
| Program Flash Memory | — | 4 KB |
| RAM | — | 256 B |
| 供應電壓 | — | 2.7 V to 5.5 V |
| 內建溫度感測器 | — | Yes |
| Communication Interfaces | — | SCI (UART), SPI, I2C |
| Interrupt Sources | — | Up to 32 |
| 封裝 | — | 20-pin PDIP (DIP-20, 0.300 inch / 7.62 mm) |
| Temperature Grade | — | Automotive |
| Compatibility Family | — | S08SH, software/tool compatible with S08SG |
| Debug | — | Background Debug Mode (BGND) |
| RoHS 狀態 | — | [DATA_NEEDED: RoHS status] |