MC9S12DG128MPVE vs MC9S12DP512MPVE 比較

詳細並排比較 MC9S12DG128MPVE 由 NXP Semiconductors 與 MC9S12DP512MPVE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S12DG128MPVE MC9S12DG128MPVE - 16-bit HCS12 MCU, 128KB Flash, 112-LQFP | NXP

MC9S12DG128MPVE - 16-bit HCS12 MCU, 128KB Flash, 112-LQFP | NXP

MC9S12DG128MPVE Nrnd
NXP Semiconductors
MC9S12DP512MPVE MC9S12DP512MPVE - 16-bit 25MHz 512KB Flash MCU | NXP

MC9S12DP512MPVE - 16-bit 25MHz 512KB Flash MCU | NXP

MC9S12DP512MPVE ✓ 啟用中

規格比較

參數 MC9S12DG128MPVE MC9S12DP512MPVE
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND 啟用中
Product Family S12DG (HCS12) —
Core Architecture HCS12 (CPU12, 16-bit CISC) —
CPU Clock Frequency 25 MHz (max) —
Bus Clock 50 MHz (max) —
Program Memory (Flash) 128 KB —
RAM 8 KB —
EEPROM 2 KB —
供應電壓 2.35 V to 2.75 V (core) / 5 V I/O [DATA_NEEDED: supply voltage range]
工作溫度範圍 -40C to +125C (automotive grade) —
Digital I/O Pins 59 —
ADC 2 x 10-bit, 8 channels each (16 total) —
PWM Channels 8 channels 8-channel pulse-width modulator
Enhanced Capture Timer 8-channel IC/OC —
SCI (UART) Channels 2 —
SPI Channels 1 —
CAN Module 1 (msCAN) —
封裝 112-LQFP (20 x 20 mm, 0.5 mm pitch) 112-LQFP (20x20 mm)
安裝類型 Surface Mount Surface Mount
RoHS 狀態 Compliant —
生命週期狀態 NRND (Not Recommended for New Designs) Active
Core Processor — HCS12 (CPU12), 16-bit CISC
Core Size — 16-bit
最大時脈頻率 — 25 MHz
Program Memory Size — 512 KB (512K x 8) Flash
RAM Size — 12 KB
EEPROM Size — 4 KB
Number of I/O — 91 general-purpose I/O
ADC Resolution — 10-bit
Number of ADC Channels — 16 (two 8-channel 10-bit ADCs)
Serial Interfaces — 2x SCI (asynchronous serial), IIC, SPI
Timers — 8-channel enhanced capture timer (IC/OC)
Program Memory Type — FLASH (0.25 um)
工作溫度 — [DATA_NEEDED: operating temperature range]

資料表與資源

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