MC9S12XDG128MAA vs MC9S12XDT512MAA 比較
詳細並排比較 MC9S12XDG128MAA 由 NXP Semiconductors 與 MC9S12XDT512MAA 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MC9S12XDG128MAA - 16-bit HCS12X MCU, 128KB Flash, 80MHz, 80-QFP | NXP
MC9S12XDG128MAA ✗ 停產規格比較
| 參數 | MC9S12XDG128MAA | MC9S12XDT512MAA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 停產終止 | NRND |
| Core Architecture | HCS12X (16-bit CISC, enhanced) | — |
| CPU Core | S12X with XGATE co-processor | — |
| Maximum CPU Frequency | 80 MHz (40 MHz bus) | — |
| Program Memory (Flash) | 128 KB (128K x 8) | — |
| RAM | 12 KB | — |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Operating Voltage | 2.5 V or 5 V (single supply with internal regulator) | — |
| 封裝 | 80-pin QFP (14 x 14 mm), MAA suffix | 80-QFP (14x14 mm), Square, Gull Wing |
| 安裝類型 | Surface Mount | Surface Mount |
| GPIO Count | [DATA_NEEDED: GPIO count] | — |
| ADC | 8/10/12-bit, multi-channel [DATA_NEEDED: channel count] | — |
| CAN Modules (msCAN) | Multiple msCAN 2.0 A/B [DATA_NEEDED: number] | — |
| Communication Interfaces | CAN, SCI, SPI, I2C, J1850 | — |
| Timers | ECT (Enhanced Capture Timer), PIT, RTI [DATA_NEEDED: count] | — |
| 工作溫度 | -40C to +125C (industrial / automotive grade) | -40C to +125C (TA) |
| MSL 等級 | [DATA_NEEDED: MSL] | — |
| RoHS 狀態 | Compliant | — |
| Background Debug Mode | Yes (BDM, single-wire) | — |
| Instruction Set Compatibility | Upward-compatible with HCS12, instruction queue, enhanced indexed addressing | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 512KB (512K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 20KB |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 59 |
| ADC Resolution | — | 10-bit, 8-channel |
| 供應電壓 | — | [DATA_NEEDED: supply voltage range] |
| Packaging Method | — | Tray |
| 無鹵素 | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |