MC9S12XEP768CAG vs MC9S12XDP512MAL 比較

詳細並排比較 MC9S12XEP768CAG 由 NXP Semiconductors 與 MC9S12XDP512MAL 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S12XEP768CAG MC9S12XEP768CAG - 16-Bit HCS12X MCU 768KB Flash 144-LQFP | NXP

MC9S12XEP768CAG - 16-Bit HCS12X MCU 768KB Flash 144-LQFP | NXP

MC9S12XEP768CAG ✓ 啟用中
NXP Semiconductors
MC9S12XDP512MAL MC9S12XDP512MAL - 16-Bit HCS12X MCU, 512KB Flash, 80MHz | NXP

MC9S12XDP512MAL - 16-Bit HCS12X MCU, 512KB Flash, 80MHz | NXP

MC9S12XDP512MAL Nrnd

規格比較

參數 MC9S12XEP768CAG MC9S12XDP512MAL
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 NRND
Core HCS12X (16-bit) with XGATE co-processor —
Maximum CPU Frequency 50 MHz —
Program Flash 768 KB (768K x 8) with ECC —
SRAM 32 KB —
Data Flash [DATA_NEEDED: Data Flash size] —
Operating Voltage 1.8V / 2.8V / 5V —
Supply Voltage Range [DATA_NEEDED: full VIN min/max range] —
工作溫度 -40C to +85C (automotive grade) [DATA_NEEDED: operating temperature range]
CAN Modules 4 x msCAN (CAN 2.0A/B) —
ADC 2 x 10-bit ADC, up to 24 channels —
PWM Channels Up to 8 channels —
SCI / LIN 2 x SCI (LIN-capable) —
SPI 3 x SPI —
Timers 8-channel 16-bit timer with capture/compare —
Debug Interface JTAG and BDM —
封裝 144-LQFP (20x20 mm) 112-LQFP (20x20 mm)
安裝類型 Surface Mount Surface Mount
MSL 等級 [DATA_NEEDED: MSL level] —
RoHS 狀態 Compliant —
Core Processor — HCS12X
Core Size — 16-Bit
Program Memory Size — 512 KB (512K x 8) Flash
RAM Size — 32 KB
EEPROM Size — 4 KB
Maximum Speed — 80 MHz
Bus Speed — 40 MHz
Number of I/O — 91
供應電壓 — 2.35 V to 2.75 V core
Connectivity — CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT, ECT, ADC
ADC Channels — 24-channel 10-bit

資料表與資源

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