MC9S12XEQ384CAG vs MC9S12XDP512VAL 比較

詳細並排比較 MC9S12XEQ384CAG 由 NXP Semiconductors 與 MC9S12XDP512VAL 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S12XEQ384CAG MC9S12XEQ384CAG - 16-bit 50MHz MCU 384KB Flash | NXP

MC9S12XEQ384CAG - 16-bit 50MHz MCU 384KB Flash | NXP

MC9S12XEQ384CAG ✓ 啟用中
NXP Semiconductors
MC9S12XDP512VAL MC9S12XDP512VAL - 16-bit 80MHz HCS12X MCU 512KB Flash | NXP

MC9S12XDP512VAL - 16-bit 80MHz HCS12X MCU 512KB Flash | NXP

MC9S12XDP512VAL ✓ 啟用中

規格比較

參數 MC9S12XEQ384CAG MC9S12XDP512VAL
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Core Processor HCS12X (16-bit CISC) HCS12X
Core Size 16-bit —
Bus Speed 50 MHz —
Co-processor XGATE RISC co-processor XGATE
Flash Memory 384 KB (384K x 8) —
RAM Size 24K x 8 [DATA_NEEDED: RAM size in KB]
EEPROM Hardware-emulated EEPROM (programmable, flexible) —
ADC Resolution 12-bit —
ADC Conversion Time 3 us —
Timers Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), Real Time Interrupt (RTI) —
Memory Protection MPU with supervisor/user modes —
I/O Ports [DATA_NEEDED: I/O Ports count] —
工作溫度 -40C to +85C (TA) [DATA_NEEDED: automotive -40C to +105C or -40C to +125C grade]
安裝類型 Surface Mount Surface Mount
封裝 144-LQFP (20x20 mm) —
Packaging Tray —
供應電壓 [DATA_NEEDED: Supply Voltage] 2.35 V to 2.75 V
Lifecycle Stage Active —
Core Architecture — 16-bit CISC
Maximum CPU Frequency — 80 MHz
Program Memory Size — 512 KB (512K x 8) Flash
EEPROM Size — [DATA_NEEDED: EEPROM emulation size]
I/O Pins — 119
Package Type — 112-pin LQFP (20 x 20 mm)
CAN Modules — Multiple MSCAN (CAN 2.0A/B)
ADC — 8/10-bit ATD (S12ATD10B8CV3)
Instruction Set Compatibility — Upward-compatible with HCS12
ROM Type — Flash
生命週期狀態 — Active
RoHS 狀態 — [DATA_NEEDED: RoHS compliance]

資料表與資源

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