MCF5329CVM240J vs MCF53281CVM240 比較

詳細並排比較 MCF5329CVM240J 由 NXP Semiconductors 與 MCF53281CVM240 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MCF5329CVM240J MCF5329CVM240J - 240MHz ColdFire V3 MPU 32-Bit ROMless 256-MAPBGA | NXP

MCF5329CVM240J - 240MHz ColdFire V3 MPU 32-Bit ROMless 256-MAPBGA | NXP

MCF5329CVM240J ✓ 啟用中
NXP Semiconductors
MCF53281CVM240 MCF53281CVM240 - ColdFire V3 MPU, 240MHz, 256-MAPBGA | NXP

MCF53281CVM240 - ColdFire V3 MPU, 240MHz, 256-MAPBGA | NXP

MCF53281CVM240 Nrnd

規格比較

參數 MCF5329CVM240J MCF53281CVM240
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 NRND
Core Architecture ColdFire V3 (Version 3) variable-length RISC Version 3 ColdFire
資料匯流排寬度 32 bit —
最大時脈頻率 240 MHz —
Program Memory Type ROMless (external flash required) ROMless (external memory required)
封裝 256-MAPBGA 17 mm × 17 mm, 1.0 mm pitch 256-MAPBGA (17x17 mm)
安裝類型 Surface Mount (BGA) Surface Mount
On-chip SRAM [DATA_NEEDED: on-chip SRAM size] —
Ethernet Integrated Fast Ethernet MAC (10/100) —
USB USB On-The-Go (OTG) controller —
SD Host Controller eSDHC (enhanced SDHC) —
CAN FlexCAN —
Serial Interfaces UART, SPI, I2C —
External Memory Support DDR SDRAM, NAND flash, NOR flash, SRAM —
JTAG Debug Yes (IEEE 1149.1 boundary-scan + BDM) —
工作溫度 [DATA_NEEDED: operating temperature range] —
供應電壓 [DATA_NEEDED: core I/O supply voltage] —
Processor Series MCF532xx —
RoHS 狀態 ROHS3 Compliant [DATA_NEEDED: RoHS status from NXP product page]
Core — ColdFire V3 (variable-length RISC, 32-bit)
Maximum Core Frequency — 240 MHz
On-chip Program Memory — None
RAM Size — 32K x 8 (256 Kbit on-chip SRAM)
Number of I/O — 94
Oscillator Type — External
Integrated LCD Controller — Yes (first LCD controller integrated on ColdFire family)
Debug Interface — JTAG (IEEE 1149.1), BDM
Operating Temperature Grade — Industrial
Packaging — Tray
Lead-Free — [DATA_NEEDED: lead-free status]
Connectivity — Ethernet MAC, USB OTG, CAN

資料表與資源

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