MCF5329CVM240J vs MCF5329CVM240 比較

詳細並排比較 MCF5329CVM240J 由 NXP Semiconductors 與 MCF5329CVM240 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MCF5329CVM240J MCF5329CVM240J - 240MHz ColdFire V3 MPU 32-Bit ROMless 256-MAPBGA | NXP

MCF5329CVM240J - 240MHz ColdFire V3 MPU 32-Bit ROMless 256-MAPBGA | NXP

MCF5329CVM240J ✓ 啟用中
NXP Semiconductors
MCF5329CVM240 MCF5329CVM240 - ColdFire V3 MPU, 240MHz, 256-LBGA | NXP

MCF5329CVM240 - ColdFire V3 MPU, 240MHz, 256-LBGA | NXP

MCF5329CVM240 Nrnd

規格比較

參數 MCF5329CVM240J MCF5329CVM240
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 NRND
Core Architecture ColdFire V3 (Version 3) variable-length RISC ColdFire V3 (VLRISC)
資料匯流排寬度 32 bit —
最大時脈頻率 240 MHz 240 MHz
Program Memory Type ROMless (external flash required) ROMless (external memory bus required)
封裝 256-MAPBGA 17 mm × 17 mm, 1.0 mm pitch 256-LBGA (MAPBGA)
安裝類型 Surface Mount (BGA) Surface Mount
On-chip SRAM [DATA_NEEDED: on-chip SRAM size] 32 KB
Ethernet Integrated Fast Ethernet MAC (10/100) 10/100 MAC integrated
USB USB On-The-Go (OTG) controller USB 2.0 Full-Speed OTG
SD Host Controller eSDHC (enhanced SDHC) —
CAN FlexCAN —
Serial Interfaces UART, SPI, I2C —
External Memory Support DDR SDRAM, NAND flash, NOR flash, SRAM —
JTAG Debug Yes (IEEE 1149.1 boundary-scan + BDM) —
工作溫度 [DATA_NEEDED: operating temperature range] -40C to +85C (industrial)
供應電壓 [DATA_NEEDED: core I/O supply voltage] 1.5 V core / 3.3 V I/O (typical, refer to datasheet)
Processor Series MCF532xx —
RoHS 狀態 ROHS3 Compliant Compliant
Core Bit Width — 32-bit
Unified Cache — 16 KB write-back
Number of I/O Lines — 94
Oscillator Type — External
LCD Controller — Integrated (TFT/STN, first integrated LCD on ColdFire)
Debug Interface — JTAG/BDM/OnCE
Packaging — Tray

資料表與資源

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