MCZ33903BD3EK vs MCZ33903CD5EK 比較

詳細並排比較 MCZ33903BD3EK 由 NXP Semiconductors 與 MCZ33903CD5EK 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MCZ33903BD3EK MCZ33903BD3EK - SBC CAN HS 3.3V 32-SOIC EP | NXP

MCZ33903BD3EK - SBC CAN HS 3.3V 32-SOIC EP | NXP

MCZ33903BD3EK Obsolete
NXP Semiconductors
MCZ33903CD5EK MCZ33903CD5EK - SBC with HS-CAN & LIN, 5V LDO | NXP

MCZ33903CD5EK - SBC with HS-CAN & LIN, 5V LDO | NXP

MCZ33903CD5EK ⚠ 最後購買機會

規格比較

參數 MCZ33903BD3EK MCZ33903CD5EK
品牌 NXP Semiconductors NXP Semiconductors
類別 Specialized Power ICs Voltage Regulators
生命週期狀態 Obsolete 最後購買
Product Type System Basis Chip (SBC Gen2) —
Manufacturer NXP Semiconductors (formerly Freescale) —
Supply Voltage (VCC) 5.5 V to 28 V —
Auxiliary Regulator Output 3.3 V —
CAN Interface High-Speed CAN, Normal/Sleep modes, ISO 11898 ISO 11898-2 / ISO 11898-5 High-Speed CAN
LIN Interface LIN 2.x physical layer LIN 2.0 / LIN 2.1 / SAE J2602
封裝 / 外殼 32-SSOP Exposed Pad (7.50 mm body width) —
Supplier Device Package 32-SOIC EP —
安裝類型 Surface Mount Surface Mount
工作溫度 -40C to +125C (automotive AEC-Q100 grade [DATA_NEEDED: specific grade]) -40 C to +125 C
SPI Control Interface Yes (configuration, diagnostics, watchdog) —
Status / Lifecycle End-of-Life / Obsolete per NXP product page —
Lead-Free Status [DATA_NEEDED: confirm per lot] —
RoHS 狀態 [DATA_NEEDED: confirm per lot] Compliant per NXP product page
Original Packaging Tube —
功能 — System Basis Chip (SBC) with HS-CAN and LIN
On-chip LDO Output — 5 V
LDO Output Current — 200 mA
Operating Voltage (VBAT) — 5.5 V to 27 V (load dump tolerant to 40 V)
Low-Side Drivers — 4 x configurable, 1.5 A each
Maximum CAN Data Rate — 1 Mbps
Sleep Mode Current — <100 uA (typical)
Configuration Interface — SPI
Watchdog — Configurable window watchdog via SPI
ESD Protection (CAN bus pins) — 8 kV HBM (per datasheet)
封裝 — 32-SSOP-EP (7.50 mm width, exposed pad)
AEC-Q100 — Qualified (automotive)

資料表與資源

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