MPC8250ACZQIHBC vs MPC8270CVRMIBA 比較
詳細並排比較 MPC8250ACZQIHBC 由 NXP Semiconductors 與 MPC8270CVRMIBA 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC Obsolete
規格比較
| 參數 | MPC8250ACZQIHBC | MPC8270CVRMIBA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | Obsolete | 停產終止 |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC II | PowerQUICC II (MPC82xx) |
| Core Processor | PowerPC G2 | — |
| Core Architecture | PowerPC 603e, 32-Bit RISC | — |
| Clock Speed | 200 MHz | 266 MHz |
| Number of Cores | 1 (CPU) + 1 CPM | — |
| 資料匯流排寬度 | 64-Bit | 64-Bit |
| Supply Voltage (Core) | 1.8 V | 1.5 V |
| Supply Voltage (I/O) | 3.3 V | — |
| 工作溫度 | -40C to +105C (industrial) | -40 C to +105 C |
| Package Type | TEPBGA / Plastic BGA | 516-PBGA (27 x 27 mm, 1 mm pitch) |
| 腳位數 | 516 | — |
| Package Dimensions | 27 x 27 mm | — |
| Ball Pitch | 1.0 mm | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Process Technology | 0.25 um CMOS | — |
| Instruction Cache | 32 KB | — |
| Data Cache | 32 KB | — |
| Integrated Peripheral | PCI bridge, CPM (communications processor module) | — |
| MSL 等級 | 3 (168 hours) | [DATA_NEEDED: MSL moisture sensitivity level] |
| Lead Free | Yes (per datasheet package code) | — |
| Architecture | — | PowerPC G2_LE |
| Core | — | 1 Core, 32-Bit |
| I/O Voltage | — | 3.3 V |
| Integrated Peripherals | — | PCI (32-bit, v2.2), USB 2.0, HDLC, 3x 10/100 Ethernet MAC, I2C, UART |
| Process Node | — | 0.13 µm (HiP7) |
| Height (max) | — | 2.25 mm |
| RoHS 狀態 | — | Lead-Free / Compliant (per package marking) |
| Ethernet Speed | — | 10/100 Mbps (3 ports) |
| USB Version | — | USB 2.0 |
| Product Status | — | End of Life (EOL) - Discontinuance issued |