MPC8306CVMADDCA vs MPC8308CVMADD 比較

詳細並排比較 MPC8306CVMADDCA 由 NXP Semiconductors 與 MPC8308CVMADD 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC8306CVMADDCA MPC8306CVMADDCA - PowerQUICC II Pro 266MHz SoC | NXP Semiconductors

MPC8306CVMADDCA - PowerQUICC II Pro 266MHz SoC | NXP Semiconductors

MPC8306CVMADDCA ⚠ 最後購買機會
NXP Semiconductors
MPC8308CVMADD MPC8308CVMADD - PowerQUICC II Pro SoC 266MHz | NXP Semiconductors

MPC8308CVMADD - PowerQUICC II Pro SoC 266MHz | NXP Semiconductors

MPC8308CVMADD ✓ 啟用中

規格比較

參數 MPC8306CVMADDCA MPC8308CVMADD
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 最後購買 啟用中
Manufacturer NXP Semiconductors NXP Semiconductors (formerly Freescale)
Series MPC830x PowerQUICC II Pro PowerQUICC II Pro
Core Architecture Power Architecture (e300c3) —
Core Count 1 1
資料匯流排寬度 32-bit 32-bit
最大時脈頻率 266 MHz —
Core Supply Voltage 0.95 V to 1.05 V —
I/O Supply Voltage 3.3 V —
L1 Instruction Cache 16 KB —
L1 Data Cache 16 KB —
Memory Controller DDR1/DDR2 with ECC, up to 256 MB DDR2 up to 266 MHz data rate
Ethernet 2x 10/100 (R/MII) with QoS, IEEE 1588 v2 —
USB 2x USB 2.0 Full-Speed (Host/Device/OTG) USB 2.0
CAN 2x CAN 2.0B —
UART 4x —
Other Peripherals I2C x2, SPI, Local Bus, HDLC/TDM —
Security Engine SEC 2.0 (DES/3DES/AES/SHA, RNG) —
封裝 369-PBGA (19x19 mm) 473-MAPBGA (19x19 mm)
工作溫度 -40C to +105C (extended) -40C to +105C (extended)
安裝類型 Surface Mount Surface Mount
Packaging Tray —
Lead Free / RoHS Lead Free / RoHS Compliant —
Lifecycle Last Time Buy (EOL announced) —
Core — e300c3 (Power Architecture Book-E)
Core Frequency — 266 MHz
Instruction Cache — 16 KB
Data Cache — 16 KB
PCI Express — 1 x PCIe interface
Ethernet MACs — 2 x 10/100/1000 (MII, RGMII)
Local Bus — Yes (with NAND flash support)
RoHS 狀態 — [DATA_NEEDED: confirm from lot]

資料表與資源

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