MPC8313ECVRADDB vs MPC8313CVRADDB 比較
詳細並排比較 MPC8313ECVRADDB 由 NXP Semiconductors 與 MPC8313CVRADDB 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MPC8313ECVRADDB - PowerQUICC II Pro MPU, 267MHz, 516-TEPBGA | NXP
MPC8313ECVRADDB ⚠ 最後購買機會規格比較
| 參數 | MPC8313ECVRADDB | MPC8313CVRADDB |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 最後購買 | 啟用中 |
| Processor Type | PowerPC e300c3, MPC83xx PowerQUICC II Pro | — |
| Core Architecture | 32-bit RISC, single core | PowerPC e300c3 |
| Maximum CPU Clock | 267 MHz | — |
| Cache (I-cache / D-cache) | 16 KB / 16 KB | — |
| Security Accelerator | SEC 2.x (DES, 3DES, AES, SHA-1, MD5, ARC4) | — |
| Ethernet MAC | 2x 10/100/1000 (TSEC) | — |
| Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 SDRAM |
| PCI Express / PCI | 1x PCIe + 1x PCI 2.3 | — |
| USB | USB 2.0 (host/device) | USB 2.0 High-Speed with integrated PHY |
| I/O Voltage | 1.8 V / 2.5 V / 3.3 V | — |
| Core Voltage | 0.95 V to 1.05 V | — |
| 工作溫度 | -40C to +105C (industrial) | — |
| 封裝 / 外殼 | 516-TEPBGA, 27x27 mm | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Lead Free Status | Lead Free | — |
| Process Technology | 90 nm CMOS | — |
| MSL 等級 | 3 | — |
| RoHS 狀態 | Compliant (per DigiKey listing) | Compliant |
| Number of Cores | — | 1 |
| 資料匯流排寬度 | — | 32-bit |
| Maximum Core Frequency | — | 267 MHz |
| 封裝 | — | 516-TEPBGA (27x27 mm) |
| Package Code | — | BGA |
| Terminal Form | — | Ball |
| Number of Terminals | — | 516 |
| Operating Temperature Grade | — | Industrial |
| Ethernet | — | Dual 10/100/1000 MAC |
| PCI Express | — | 1 x PCIe x1 lane |
| Communications Accelerator | — | QUICC Engine |
| Encryption | — | Without (W/O ENCR) |
| Series | — | MPC83xx |