MPC8347EVVAGDB vs MPC8349EVVAGDB 比較
詳細並排比較 MPC8347EVVAGDB 由 NXP Semiconductors 與 MPC8349EVVAGDB 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MPC8347EVVAGDB - PowerQUICC II Pro, 400MHz e300 MPU, 672-LBGA | NXP
MPC8347EVVAGDB ⚠ 最後購買機會規格比較
| 參數 | MPC8347EVVAGDB | MPC8349EVVAGDB |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 最後購買 | 最後購買 |
| Architecture | Power Architecture e300 core (32-bit RISC, superscalar) | — |
| Core Frequency | 400 MHz | 400 MHz |
| Instruction Set | Power Architecture, 32-bit | — |
| L1 Cache | 32 KB instruction + 32 KB data | — |
| Memory Controller | DDR1 / DDR2, up to 333 MHz, ECC support | DDR1 / DDR2, up to 333 MHz |
| Maximum DRAM | 1 GB DDR2 (per controller) | — |
| PCI Interface | PCI 2.3, 32-bit, up to 66 MHz | — |
| Ethernet MACs | 2 (one RGMII, one GMII/TBI), 10/100/1000 Mbps | — |
| USB Controller | USB 2.0 High-Speed Host/Device/OTG with on-chip PHY | — |
| Security Engine | SEC 2.0 (DES/3DES/AES, SHA-1, MD5) | — |
| DMA Channels | 16 | — |
| QUICC Engine | 1x QE, 333 MHz, multi-SCC/FCC | — |
| 供應電壓 | 1.8 V core, 2.5 V I/O, 3.3 V I/O | — |
| Process Technology | 0.13 micron CMOS | 0.13 um CMOS |
| 工作溫度 | 0 C to +105 C (industrial grade) | 0C to +105C |
| 封裝 | 672-pin LBGA (TBGA), 35 mm x 35 mm | 672-TBGA (35x35 mm) |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (TBGA) |
| RoHS 狀態 | Contains lead (non-RoHS per search-data; verify before use) | — |
| Encryption Support | SEC 2.0 hardware accelerator | — |
| Core Architecture | — | PowerPC e300 |
| Family | — | PowerQUICC II Pro (MPC83xx) |
| Core Count | — | 1 |
| 資料匯流排寬度 | — | 32-Bit |
| I/O Voltage | — | 1.8V / 2.5V / 3.3V |
| PCI Controllers | — | 2 x PCI 2.3 (one 64-bit) |
| Ethernet | — | 2 x 10/100/1000 MAC (1GbE) |
| USB | — | USB 2.0 Full/Low-Speed |
| Security Engine (SEC) | — | DES / 3DES / AES / SHA hardware acceleration |
| Lead-Free (Pb-Free) | — | Yes |
| Tray Packaging | — | Tray |