MPC8358ECVRAGDDA vs MPC8358EZQAGDDA 比較
詳細並排比較 MPC8358ECVRAGDDA 由 NXP Semiconductors 與 MPC8358EZQAGDDA 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC8358ECVRAGDDA | MPC8358EZQAGDDA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 最後購買 | 啟用中 |
| Processor Type | PowerPC e300 (MPC83xx PowerQUICC II Pro) | — |
| Core Architecture | 32-bit PowerPC e300, 1 core | PowerPC e300 (single core) |
| Core Frequency | 400 MHz | — |
| Process Technology | 0.13 um CMOS | — |
| Core Voltage | 1.2 V | — |
| I/O Voltage | 1.8 V / 2.5 V / 3.3 V | — |
| Communications Engine | QUICC Engine (programmable multi-channel) | — |
| Security Accelerator | SEC (IPSec / SSL / 3DES / AES) | — |
| Memory Controller | DDR1 / DDR2, 32-bit with ECC | — |
| Ethernet | 2x Gigabit Ethernet MACs (1 GbE) | Up to 3 x 10/100/1000 Mbit (via QUICC Engine) |
| PCI Interface | 32-bit PCI 2.3 | — |
| USB | USB 2.0 Full-Speed | USB 2.0 (Full/High Speed) |
| TDM / Serial | 8x TDM / HDLC / UART channels | — |
| ATM Support | AAL2 / AAL5 | — |
| 封裝 | 668-PBGA-PGE (29x29 mm) with exposed pad | — |
| 工作溫度 | -40 C to +105 C (industrial) | 0 C to +105 C (junction) |
| Packaging | Tray | — |
| Lead-Free Status | Lead Free | — |
| RoHS 狀態 | Compliant | — |
| 資料匯流排寬度 | — | 32-bit |
| Maximum Core Frequency | — | 400 MHz |
| Core Supply Voltage | — | 1.2 V |
| Package Type | — | 668-pin TE-PBGA-PGE (29x29 mm) |
| 安裝類型 | — | Surface Mount |
| Memory Interface | — | DDR1/DDR2 with ECC |
| PCI | — | PCI 2.2, 32-bit, up to 66 MHz |
| Serial Protocols | — | ATM, HDLC, TDM, UART |
| Security Engine | — | SEC 2.0 (IPSec/SSL/3GPP acceleration) |
| Local Bus | — | 8 chip selects, SRAM/Flash/NOR |
| Lead-Free / RoHS | — | Lead-free finish; RoHS compliant |
| MSL 等級 | — | [DATA_NEEDED: MSL moisture sensitivity level] |