MPC855TZQ80D4 vs MPC855TVR66D4 比較
詳細並排比較 MPC855TZQ80D4 由 NXP Semiconductors 與 MPC855TVR66D4 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC855TZQ80D4 | MPC855TVR66D4 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 停產終止 | 停產終止 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Product Type | Microprocessor Unit (MPU) | — |
| Series | PowerQUICC MPC8xx (MPC855T) | — |
| Core Architecture | Power Architecture MPC8xx, 32-bit | — |
| Core Clock Frequency | 80 MHz | — |
| Communication Processor Module (CPM) | Integrated RISC engine with FCC/ATM/HDLC | — |
| Ethernet Support | 10/100 Mbps Fast Ethernet MAC | Fast Ethernet (100 Mbps) |
| Serial Protocols | ATM, HDLC, SS#7 (via CPM) | — |
| PCMCIA Interface | Yes (1 or 2 slots) | — |
| Memory Bus Width | 32-bit (external) | — |
| 資料匯流排寬度 | 32 bit | 32 bit |
| Process Technology | 0.32 um CMOS | 0.32 µm |
| 工作溫度 | 0 °C to +95 °C (commercial 'Z' grade) | 0 °C to +95 °C |
| 封裝 | 357-pin PBGA, 25 x 25 mm (ZQ/ZU tray) | 357-PBGA (25x25 mm) |
| 安裝類型 | Surface Mount, BGA | Surface Mount |
| RoHS 狀態 | Not compliant (SnPb-ball BGA, pre-RoHS generation) | [DATA_NEEDED: RoHS status] |
| Lead-Free | No (SnPb solder balls) | [DATA_NEEDED: lead-free status] |
| Lifecycle | Discontinued — see Discontinuance PCN | — |
| Processor Series | — | MPC8xx / PowerQUICC |
| Core | — | MPC8xx (single core) |
| 最大時脈頻率 | — | 66 MHz |
| Communication Interfaces | — | ENET, ATM, HDLC, PCMCIA |
| Communication Processor Module | — | Yes (CPM, dedicated RISC engine) |
| 類別 | — | Microprocessors (MPU) |
| Tray Packaging | — | Tray |