MPC8572ECVTAVNE vs MPC8572ECPXAULD 比較
詳細並排比較 MPC8572ECVTAVNE 由 NXP Semiconductors 與 MPC8572ECPXAULD 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MPC8572ECPXAULD - PowerQUICC III Dual-Core SoC 1.333GHz | NXP
MPC8572ECPXAULD Nrnd規格比較
| 參數 | MPC8572ECVTAVNE | MPC8572ECPXAULD |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | NRND |
| Processor Type | MPC85xx PowerQUICC III | — |
| Core Architecture | PowerPC e500, dual-core, 32-bit RISC | — |
| Maximum CPU Clock | 1.5 GHz | — |
| Process Technology | 0.09 um CMOS | 90 nm CMOS |
| Core Voltage | 1.1 V | — |
| I/O Voltage | 1.8 V / 2.5 V / 3.3 V | — |
| Number of Cores | 2 | — |
| L2 Cache | [DATA_NEEDED: L2 cache size] | 512 KB (shared) |
| Memory Controller | DDR2/DDR3 with ECC (per datasheet family) | DDR2 / DDR3 with ECC |
| Ethernet MACs | 4x 10/100/1000 Mbit | — |
| PCI Express | 2x PCIe interfaces | — |
| Serial RapidIO | 2x endpoints | — |
| Security Engine | SEC 4.0 (IPSec/SSL/Kasumi/Snow 3G) | — |
| 封裝 | 1023-ball FCBGA (33x33 mm) | — |
| 安裝類型 | Surface Mount | — |
| 工作溫度 | [DATA_NEEDED: industrial temp grade] | — |
| RoHS 狀態 | [DATA_NEEDED: confirm RoHS for this part suffix] | Compliant (data-needs verification at supplier page) |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Family | — | PowerQUICC III (MPC85xx) |
| Processor Core | — | PowerPC e500 (dual-core) |
| Core Count | — | 2 |
| 資料匯流排寬度 | — | 32-bit |
| 最大時脈頻率 | — | 1.333 GHz |
| 工作電源電壓 | — | 1.1 V core / 1.8 V / 2.5 V / 3.3 V I/O |
| Package Type | — | 1023-ball FCBGA (33 x 33 mm) |
| 安裝方式 | — | Surface Mount (BGA) |
| Instruction Set | — | PowerISA 32-bit |
| Ethernet Controllers | — | 4 x 10/100/1000 Mbps tri-speed MACs with SerDes |
| 工作溫度範圍 | — | Industrial (TBD) [DATA_NEEDED: exact -40C/+85C confirmation] |
| MSL 等級 | — | [DATA_NEEDED: moisture sensitivity level] |