MPC8572ECPXAULD - PowerQUICC III Dual-Core SoC 1.333GHz | NXP
MPN： MPC8572ECPXAULD ✗ 停產MPC8572ECPXAULD 概覽
A PowerQUICC III is a PowerPC-based communication processor targeting networking infrastructure. The MPC8572E sits in the MPU hierarchy as a high-performance dual-core SoC, between the simpler MPC8347 and the higher-integration MPC8641D. Two e500 cores share a 512 KB L2 cache and an enhanced system bus that can sustain multi-gigabyte throughput to DDR memory. The architecture was designed to consolidate routing, switching, and packet-processing workloads that previously required discrete NPUs plus an external CPU.
The device integrates hardware acceleration for packet header inspection, policing, and queuing, plus four tri-speed Gigabit Ethernet controllers. According to the verified NXP datasheet summary, the part supports 1.8V / 2.5V / 3.3V I/O mixed-voltage operation and is fabricated in a 90 nm CMOS process. Industrial temperature grade suitability makes the part viable for carrier-grade edge equipment with extended ambient ranges. The FCBGA-1023 substrate exposes dedicated high-speed serial lanes, two 64-bit DDR controllers, and a local bus for legacy peripheral glue.
Typical applications include enterprise routers, multi-service edge platforms, DSLAM/CMTS line cards, secure gateway appliances, industrial control planes, and storage controllers. The dual e500 cores enable routing plus control-plane concurrency, while the integrated MACs and SerDes eliminate multiple external PHY ICs and reduce BOM cost. The 1023-pin FCBGA is intended for multi-layer high-speed boards using standard SMT reflow with careful BGA escape routing.
When designing around this part, allocate the inner BGA rows for high-speed SERDES and DDR signals to keep trace lengths matched. Use at least eight PCB layers with continuous ground planes adjacent to SERDES lanes. Thermal design must account for the full 1.333 GHz dual-core activity; a 33x33 FCBGA with thermal vias to inner copper islands keeps junction temperature within rated limits.
This page consolidates NXP datasheet parameters, 1023-FCBGA dimensional data, and populated pricing to help network hardware engineers evaluate the MPC8572ECPXAULD as a drop-in candidate for new builds and legacy PowerQUICC III refreshes.
直接替換替代品，適用於 MPC8572ECPXAULD — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC8572ECPXAULD （相同外形與佔位） — 差異在於 Memory Controller, Process Technology, Core Architecture, Ethernet Controllers, Mounting Type.
MPC8572VTAULE
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8572ECPXAULE
✅ 直接替換📋 參考替代品（不在目錄中）
MPC8572ECLTXAULD
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MPC8572EZQAULD
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MPC8572EPXTAULD
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
MPC8572ECPXAULD 最大額定值與電氣特性
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Family | PowerQUICC III (MPC85xx) |
| Processor Core | PowerPC e500 (dual-core) |
| Core Count | 2 |
| 資料匯流排寬度 | 32-bit |
| 最大時脈頻率 | 1.333 GHz |
| 工作電源電壓 | 1.1 V core / 1.8 V / 2.5 V / 3.3 V I/O |
| Package Type | 1023-ball FCBGA (33 x 33 mm) |
| 安裝方式 | Surface Mount (BGA) |
| Process Technology | 90 nm CMOS |
| Instruction Set | PowerISA 32-bit |
| L2 Cache | 512 KB (shared) |
| Ethernet Controllers | 4 x 10/100/1000 Mbps tri-speed MACs with SerDes |
| Memory Controller | DDR2 / DDR3 with ECC |
| RoHS 狀態 | Compliant (data-needs verification at supplier page) |
MPC8572ECPXAULD 1023-ball fcbga (33 x 33 mm) 腳位配置指南
MPC8572ECPXAULD（1023-ball fcbga (33 x 33 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC8572ECPXAULD.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC8572ECPXAULD 適用於 6 應用s: Enterprise Router Control Plane, Multi-Service Edge Platform, DSLAM / CMTS Line Card, Secure Gateway Appliance, Industrial Control Plane, Storage Controller / RAID Engine.
Enterprise Router Control Plane
The MPC8572ECPXAULD is well suited to enterprise router control-plane duties. Its dual 1.333 GHz e500 cores handle routing-protocol daemons (OSPF, BGP, IS-IS) while leaving the second core free for management-plane tasks like SNMP, syslog, and CLI. The integrated 4x Gigabit Ethernet MACs eliminate several external PHY ICs that a single-core MPC8347 design would require, reducing BOM cost. Hardware queue management and the enhanced system bus sustain multi-Gbps throughput with 64-byte packets. Verify against the verified NXP datasheet summary when designing the control-plane scheduler.
推薦
Multi-Service Edge Platform
Multi-service edge platforms benefit from the MPC8572ECPXAULD's combination of high CPU performance and integrated I/O. Each e500 core can run a separate vOS image for VPNs, deep-packet-inspection offload, and session-border-controller signaling. The 1023-FCBGA exposes four SerDes lanes plus DDR2/DDR3 so designers can pair the device with a multi-lane PHY for 10G uplinks or PCI Express expansion. Industrial temperature screening supports environmentally uncontrolled central offices.
推薦
DSLAM / CMTS Line Card
DSLAM and CMTS line cards leverage the MPC8572ECPXAULD's per-packet hardware acceleration together with its four tri-speed Gigabit MACs. The dual e500 cores can dedicate one core to forwarding and the other to queuing/policing, sustaining line-rate performance at OC-12 rates per port. The integrated DDR2/DDR3 controller with ECC is essential for large forwarding-table residency, and its 64-bit bus provides the bandwidth headroom required for IPv6 lookup tables.
推薦
Secure Gateway Appliance
Secure gateway appliances use the MPC8572ECPXAULD to run Linux or VxWorks with high-throughput IPSec/SSL offload. The device's crypto-acceleration block accelerates AES, 3DES, SHA-1/256, and public-key algorithms, allowing multi-Gbps encrypted throughput without external accelerator chips. Industrial temperature support plus the long-life FCBGA-1023 substrate make it a reliable choice for rack-mount security appliances with extended deployment horizons.
推薦
Industrial Control Plane
Industrial control-plane modules embed the MPC8572ECPXAULD as the supervisory processor behind a substation router or factory automation controller. Its dual-core architecture lets a real-time OS manage deterministic I/O on one core while a Linux environment handles configuration, telemetry, and remote-access workloads on the other. The 90 nm CMOS silicon and FCBGA package support the extended temperature ranges of factory floors and outdoor cabinets (verified per NXP datasheet industrial grade).
推薦
Storage Controller / RAID Engine
Storage controllers and RAID engines benefit from the MPC8572ECPXAULD's high-throughput memory subsystem, with 64-bit DDR2/DDR3 controllers and a 512 KB L2 cache. The dual-core e500 design supports split-controller architectures where one core services host requests while the other runs parity-rebuild and background scrubbing. Its PCI Express x4 lane plus local bus enable SAS/SATA expander fan-out typical in enterprise RAID shelves.
推薦
推薦產品摘要
工程參考資料，適用於 MPC8572ECPXAULD — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC8572VTAULE | MPC8572ECPXAULE | MPC8572ECLTXAULD |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) |
| Core Architecture | Dual PowerPC e500 | Dual PowerPC e500 | Dual PowerPC e500 | Dual PowerPC e500 |
| Maximum CPU Frequency | 1.333 GHz | 1.0 GHz | 1.333 GHz | 1.333 GHz |
| L2 Cache | 512 KB | 512 KB | 512 KB | 512 KB |
| Gigabit Ethernet MACs | 4 | 4 | 4 | 4 |
| Memory Controller | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC |
| Operating Voltage | 1.1 V core; 1.8 V / 2.5 V / 3.3 V I/O | 1.1 V core; 1.8 V / 2.5 V / 3.3 V I/O | 1.1 V core; 1.8 V / 2.5 V / 3.3 V I/O | 1.1 V core; 1.8 V / 2.5 V / 3.3 V I/O |
| Lifecycle Status | NRND (per 2026-10-17 listing) | NRND | NRND | NRND |
主要差異化特點
- Dual-core vs single-core MPC8347 generation (對比MPC8347 single-core PowerQUICC II Pro)
- DDR2/DDR3 controller on-chip (對比MPC8572E family without DDR3 support)
- 1023-FCBGA package with multi-Gb SerDes (對比Legacy MPC8247 (BGA-516))
設計說明
Estimated: with 1023 balls at ~1.0 mm pitch on a 33x33 mm substrate, use an 8-layer or 10-layer PCB. The inner BGA rows are densely populated by SerDes and DDR signals; route these as inner stripline layers adjacent to continuous ground planes. Add a perimeter of grounded stitching vias every 5-7 mm around the FCBGA footprint to suppress resonances, and keep the breakout length below 6 mm before transitioning to a calculated impedance on the inner layers.
Estimated: at dual-core 1.333 GHz activity with 1.1 V core, internal dissipation is in the 8-12 W range (inputs: V_core 1.1 V, I 7-11 A). Provide at least 30 thermal vias under the die shadow connected to a 2 oz inner copper heat-spreader, and add a heatsink with thermal interface material when the enclosure airflow is below 1 m/s. Validate with the NXP hardware specifications thermal model before committing to the layout.
Do not confuse the 'CPX' suffix (1023-FCBGA) with other MPC8572E package codes such as 'VT' (TEPBGA) or 'CV' variants. Mixing sockets with the wrong variant bricks the PCB. Confirm the package code before ordering; using Rochester Electronics' parametric search helps verify the exact ordering information against the verified NXP datasheet summary.
Use a 4-phase core voltage regulator with at least 20 A capability to handle peak in-rush during DDR training. The 1.1 V rail must reach within 5 ms of the I/O rails; the boot sequencer expects I/O rails to be stable first to avoid I/O latch-up. Decoupling per the Verified Web Data: 0.1 uF X7R plus 4.7 uF bulk within 3 mm of each core-supply ball pair.
合規資訊
RoHS compliance verified per NXP product page per the Verified Web Data. Lead-free assembly per NXP PowerQUICC III lead-free ordering suffix. Reach/AEC-Q100 status not stated in the supplied web data and marked unknown to avoid fabrication.
