MPC860DPZQ80D4 vs MPC860DPZQ66D4 比較

詳細並排比較 MPC860DPZQ80D4 由 NXP Semiconductors 與 MPC860DPZQ66D4 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC860DPZQ80D4 MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP

MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP

MPC860DPZQ80D4 Obsolete
NXP Semiconductors
MPC860DPZQ66D4 MPC860DPZQ66D4 - 66MHz PowerQUICC MPU 357-PBGA | NXP

MPC860DPZQ66D4 - 66MHz PowerQUICC MPU 357-PBGA | NXP

MPC860DPZQ66D4 ⚠ 最後購買機會

規格比較

參數 MPC860DPZQ80D4 MPC860DPZQ66D4
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 Obsolete 最後購買
Processor Type MPC8xx PowerQUICC, 32-bit RISC MPU MPC8xx PowerQUICC 32-Bit RISC MPU
Core Architecture PowerPC 603-class single core —
Maximum Core Clock 80 MHz —
Core Voltage 2.2 V —
I/O Voltage 3.3 V —
Process Technology 0.32 um CMOS —
Communications Processor Module (CPM) Integrated 32-bit RISC CPM with SCC/SMC —
Serial Communication Controllers (SCC) Up to 4 channels (Ethernet, HDLC, UART) —
Serial Management Controllers (SMC) 2 channels (UART/SPI/I2C) —
Ethernet MAC 10/100 Mbps Fast Ethernet —
DMA Channels 4 channels —
Memory Controller Integrated, up to 4 DRAM banks —
封裝 / 外殼 357-PBGA (25x25 mm) 357-Ball PBGA, 25 x 25 mm
安裝類型 Surface Mount —
Packaging Tray Tray
Lead Status Contains Lead —
RoHS 狀態 Non-Compliant Non-RoHS (legacy BGA, contains lead)
工作溫度 [DATA_NEEDED: operating temperature range] 0C to +70C (commercial grade)
MSL 等級 [DATA_NEEDED: MSL rating] —
Core — 1 Core, 32-Bit PowerPC
Operating Frequency — 66 MHz
Core / I/O Voltage — 3.3 V
L1 Instruction Cache — 4 Kbyte
L1 Data Cache — 4 Kbyte
On-chip RAM (per data sheet) — [DATA_NEEDED: internal SRAM size]
Co-Processor / DSP — Communications Processor Module (CPM)
Ethernet — 10 Mbps (via CPM, Fast Ethernet not supported on DP variant)
DRAM Controller — Yes, up to 256 Mbyte addressable
Address Bus Width — 32-Bit
Lead-Free Status — Contains Lead
Part Status — Not For New Designs

資料表與資源

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