MPC860TZQ80D4 vs MPC860DPZQ80D4 比較

詳細並排比較 MPC860TZQ80D4 由 NXP Semiconductors 與 MPC860DPZQ80D4 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC860TZQ80D4 MPC860TZQ80D4 - 80MHz PowerQUICC MPU, 357-BGA | NXP

MPC860TZQ80D4 - 80MHz PowerQUICC MPU, 357-BGA | NXP

MPC860TZQ80D4 ✗ 停產
NXP Semiconductors
MPC860DPZQ80D4 MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP

MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP

MPC860DPZQ80D4 Obsolete

規格比較

參數 MPC860TZQ80D4 MPC860DPZQ80D4
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 停產終止 Obsolete
Processor Type MPC8xx PowerQUICC, 32-Bit MPC8xx PowerQUICC, 32-bit RISC MPU
Core Architecture PowerPC 32-bit PowerPC 603-class single core
Core Frequency 80 MHz —
Bus Width 32-bit —
Operating Voltage 3.3 V —
Number of Cores 1 —
Cache Memory [DATA_NEEDED: unified cache size in KB] —
Serial Communications Controllers (SCC) 4 channels —
Serial Management Controllers (SMC) 2 channels 2 channels (UART/SPI/I2C)
SPI Controllers 2 —
I2C Interface 1 —
封裝 357-BGA (PBGA), 25 x 25 mm —
安裝類型 Surface Mount Surface Mount
工作溫度 -40 C to +95 C (industrial grade per suffix T) [DATA_NEEDED: operating temperature range]
Lead Status Contains Lead (legacy PBGA) Contains Lead
RoHS 狀態 RoHS non-compliant (legacy PBGA, contains lead) Non-Compliant
Packaging Tray Tray
Process Technology 0.25 micron CMOS 0.32 um CMOS
Maximum Core Clock — 80 MHz
Core Voltage — 2.2 V
I/O Voltage — 3.3 V
Communications Processor Module (CPM) — Integrated 32-bit RISC CPM with SCC/SMC
Serial Communication Controllers (SCC) — Up to 4 channels (Ethernet, HDLC, UART)
Ethernet MAC — 10/100 Mbps Fast Ethernet
DMA Channels — 4 channels
Memory Controller — Integrated, up to 4 DRAM banks
封裝 / 外殼 — 357-PBGA (25x25 mm)
MSL 等級 — [DATA_NEEDED: MSL rating]

資料表與資源

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