MPX2100GP vs MPX2100DP 比較
詳細並排比較 MPX2100GP 由 NXP Semiconductors 與 MPX2100DP 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPX2100GP | MPX2100DP |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Pressure Sensors | Pressure Sensors |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Pressure Type | Vented Gauge | Differential |
| Operating Pressure Range | 0 to 14.5 psi (0 to 100 kPa) | 0 kPa to 100 kPa (0 to 14.5 psi) |
| Maximum Overpressure | 58.02 psi (400 kPa) | — |
| 輸出類型 | Wheatstone Bridge (analog voltage, ratiometric) | Analog mV (Wheatstone Bridge) |
| Full-Scale Span | 40 mV typical at 10 V supply | — |
| Offset | 0 mV minimum at 0 kPa | — |
| 供應電壓 | 10 V typical (ratiometric) | 10 V DC typical |
| Maximum Operating Current | 6 mA | — |
| Port Size | Male 0.19 in (4.93 mm) barbed tube | — |
| Port Style | Barbed | — |
| 封裝 | 4-SIP Module (Unibody through-hole) | — |
| 安裝類型 | Through-Hole | Through-Hole |
| Temperature Compensation | On-chip, calibrated | — |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | 0C to +85C (compensated) |
| Technology | Silicon piezoresistive, MEMS | Silicon piezoresistive, on-chip temperature compensation |
| Termination Style | PCB (SIP pins) | — |
| RoHS 狀態 | unknown | Compliant |
| Maximum Overload Pressure | — | [DATA_NEEDED: maximum overload pressure] |
| Full-Scale Span (Typical) | — | 40 mV (at 10 V excitation) |
| Zero Pressure Offset | — | [DATA_NEEDED: zero pressure offset] |
| Linearity | — | 1% typical |
| 供應電流 | — | [DATA_NEEDED: supply current] |
| Storage Temperature | — | [DATA_NEEDED: storage temperature] |
| Port Configuration | — | Dual port, axial tube, 4.93 mm (0.19 in) |
| 封裝 / 外殼 | — | 4-SIP Module (Case 344C-01) |
| MSL 等級 | — | [DATA_NEEDED: MSL rating] |